Researcher Page

사진

Kim, Joungho (김정호) C-1546-2011

Department
School of Electrical Engineering(전기및전자공학부)
Co-author
Collaboration Network Collaboration Network
Website
http://tera.ac.krHomePage
Research Area
EMI/EMC

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1

Signal Integrity Design and Analysis of a Multilayer Test Interposer for LPDDR4 Memory Test With Silicone Rubber-Based Sheet Contact

Kim, Jonghoon J.; Kim, Hee-Gon; Jung, Daniel Hyunsuk; Choi, Sumin; Lim, Jaemin; Kim, Youngwoo; Park, Junyong; Kim, Hyesoo; Ha, Dongho; Bae, Michael; Kim, JounghoresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.4, pp.1239 - 1251, 2017-08

2

Algorithm for Extracting Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling and Robustness Analysis

Piersanti, Stefano; Pellegrino, Enza; de Paulis, Francesco; Orlandi, Antonio; Jung, Daniel Hyunsuk; Kim, Dong-Hyun; Kim, Jounghoresearcher; Fan, JunIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.4, pp.1329 - 1338, 2017-08

3

An Efficient Crosstalk-Included Eye-Diagram Estimation Method for High-Speed Interposer Channel on 2.5-D and 3-D IC

Choi, Sumin; Kim, Hee-Gon; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Lim, Jaemin; Kim, JounghoresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.3, pp.927 - 939, 2017-06

4

Glass Interposer Electromagnetic Bandgap Structure for Efficient Suppression of Power/Ground Noise Coupling

Kim, Youngwoo; Cho, Jonghyun; Kim, Jonghoon J.; Cho, Kyungjun; Kim, Subin; Sitaraman, Srikrishna; Sundaram, Venky; Raj, Pulugurtha Markondeya; Tummala, Rao R.; Kim, JounghoresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.3, pp.940 - 951, 2017-06

5

Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis

Jung, Daniel Hyunsuk; Kim, Youngwoo; Kim, Jonghoon J.; Kim, Heegon; Choi, Sumin; Song, Yoon-Ho; Bae, Hyun-Cheol; Choi, Kwang-Seong; Piersanti, Stefano; de Paulis, Francesco; Orlandi, Antonio; Kim, JounghoresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.1, pp.138 - 152, 2017-01

6

Measurement and Analysis of Glass Interposer Power Distribution Network Resonance Effects on a High-Speed Through Glass Via Channel

Kim, Youngwoo; Cho, Jonghyun; Kim, Jonghoon J.; Kim, Kiyeong; Cho, Kyungjun; Kim, Subin; Sitaraman, Srikrishna; Sundaram, Venky; Raj, Pulugurtha Markondeya; Tummala, Rao; Kim, JounghoresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.58, no.6, pp.1747 - 1759, 2016-12

7

Low EMF and EMI Design of a Tightly Coupled Handheld Resonant Magnetic Field (HH-RMF) Charger for Automotive Battery Charging

Song, Chiuk; Kim, Hongseok; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Kong, Sunkyu; Kim, Jiseong; Ahn, Seungyoungresearcher; Kim, Jonghoon; Kim, JounghoresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.58, no.4, pp.1194 - 1206, 2016-08

8

Active Silicon Interposer Design for Interposer-Level Wireless Power Transfer Technology for High-Density 2.5-D and 3-D ICs

Song, Jinwook; Park, Shinyoung; Kim, Sukjin; Kim, Jonghoon J.; Kim, JounghoresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.8, pp.1148 - 1161, 2016-08

9

High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs

Lee, Man Ho; Jung, Daniel Hyunsuk; Kim, Hee-Gon; Kim, Jounghoresearcher; Cho, JonghyunIEEE COMPUTER SOCIEEE DESIGN & TEST OF COMPUTERS, v.33, no.2, pp.17 - 29, 2016-03

10

Thin PCB-Type Metamaterials for Improved Efficiency and Reduced EMF Leakage in Wireless Power Transfer Systems

Cho, Yeonje; Kim, Jonghoon; Kim, DongHyun; Lee, Seongsoo; Kim, Hongseok; Song, Chiuk; Kong, Sunkyu; Kim, Hyoungjun; Seo, Chulhun; Ahn, Seungyoungresearcher; Kim, JounghoresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.64, no.2, pp.353 - 364, 2016-02

11

Coil Design and Measurements of Automotive Magnetic Resonant Wireless Charging System for High-Efficiency and Low Magnetic Field Leakage

Kim, Hongseok; Song, Chiuk; Jung, Daniel Hyunsuk; Kim, DongHyun; Kim, In Myoung; Kim, Young Il; Kim, Jong Hoon; Ahn, Seungyoungresearcher; Kim, JounghoresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.64, no.2, pp.383 - 400, 2016-02

12

Design and Demonstration of Power Delivery Networks With Effective Resonance Suppression in Double-Sided 3-D Glass Interposer Packages

Kumar, Gokul; Sitaraman, Srikrishna; Cho, Jonghyun; Sundaram, Venky; Kim, Jounghoresearcher; Tummala, Rao RIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.1, pp.87 - 99, 2016-01

13

Recent advances in electromagnetic compatibility of 3D-ICS - Part II

Sicard, Etienne; Jianfei, Wu; Shen, Rongjun; Li, Er-Ping; Liu, En-Xiao; Kim, Jounghoresearcher; Cho, Jeong-Hyeon; Swaminathan, MadhavanInstitute of Electrical and Electronics Engineers Inc.IEEE Electromagnetic Compatibility Magazine, v.5, no.1, pp.65 - 74, 2016

14

Equivalent Circuit Modeling of Dielectric Hysteresis Loops in Through Silicon Vias

Piersanti, Stefano; De Paulis, Francesco; Orlandi, Antonio; Kim, Dong-Hyun; Kim, Jounghoresearcher; Fan, JunIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.57, no.6, pp.1510 - 1516, 2015-12

15

High-Efficiency PCB- and Package-Level Wireless Power Transfer Interconnection Scheme Using Magnetic Field Resonance Coupling

Kim, Sukjin; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Bae, Bumhee; Kong, Sunkyu; Ahn, Seungyoungresearcher; Kim, Jonghoon; Kim, JounghoresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.7, pp.863 - 878, 2015-07

16

Noise Coupling Effects on CMOS Analog-to-Digital Converter in Magnetic Field Wireless Power Transfer System Using Chip-PCB Comodeling and Simulation

Kim, Joung-Horesearcher; Bae, Bumhee; Kim, Jonghoon; Kim, Suk Jin; Kong, SunkyuIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.57, no.3, pp.329 - 338, 2015-06

17

An Investigation of Electromagnetic Radiated Emission and Interference From Multi-Coil Wireless Power Transfer Systems Using Resonant Magnetic Field Coupling

Kong, Sunkyu; Bae, Bumhee; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Kim, Suk Jin; Song, Chiuk; Kim, Jonghoon; Kim, Joung-HoresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.63, no.3, pp.833 - 846, 2015-03

18

A Wideband On-Interposer Passive Equalizer Design for Chip-to-Chip 30-Gb/s Serial Data Transmission

Kim, Hee-Gon; Cho, Jong-Hyun; Kim, Joo-Hee; Choi, Sumin; Kim, Ki-Yeong; Lee, Junho; Park, Kunwoo; Pak, Jun So; Kim, Joung-HoresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.1, pp.28 - 39, 2015-01

19

Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory)

Kim, Dae Hyun; Athikulwongse, Krit; Healy, Michael B.; Hossain, Mohammad M.; Jung, Moongon; Khorosh, Ilya; Kumar, Gokul; Lee, Young-Joon; Lewis, Dean L.; Lin, Tzu-Wei; Liu, Chang; Panth, Shreepad; Pathak, Mohit; Ren, Minzhen; Shen, Guanhao; Song, Taigon; Woo, DH; Zhao, Xin; Kim, Joung-Horesearcher; Choi, Ho; Loh, Gabriel H.; Lee, Hsien-Hsin S.; Lim, Sung KyuIEEE COMPUTER SOCIEEE TRANSACTIONS ON COMPUTERS, v.64, no.1, pp.112 - 125, 2015-01

20

Chip-Level Simultaneous Switching Current Measurement in Power Distribution Network Using Magnetically Coupled Embedded Current Probing Structure

Kim, Jonghoon J.; Cho, Changhyun; Bae, Bumhee; Kim, Suk Jin; Kong, Sunkyu; Kim, Hee-Gon; Jung, Daniel Hyunsuk; Kim, Ji-Seong; Kim, Joung-HoresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.12, pp.1963 - 1972, 2014-12

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