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사진

Kim, Joungho (김정호) C-1546-2011

Department
School of Electrical Engineering(전기및전자공학부)
Co-author
Collaboration Network Collaboration Network
Website
http://tera.ac.krHomePage
Research Area
EMI/EMC

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1

A Novel Stochastic Model-Based Eye-Diagram Estimation Method for 8B/10B and TMDS-Encoded High-Speed Channels

Park, Junyong; Choi, Sumin; Kim, Jonghoon J.; Kim, Youngwoo; Lee, Man Ho; Kim, Hee-Gon; Bae, Bumhee; Song, Huijin; Cho, Kyungjun; Lee, Seongsoo; Lee, Hyunsuk; Kim, JounghoresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.60, no.5, pp.1510 - 1519, 2018-10

2

EMI Reduction Methods in Wireless Power Transfer System for Drone Electrical Charger using Tightly-coupled Three-phase Resonant Magnetic Field

Song, Chiuk; Kim, Hongseok; Kim, Youngwoo; Kim, Dong-Hyun; Jeong, Seung Taek; Cho, Yeonje; Lee, Seongsoo; Ahn, Seungyoungresearcher; Kim, JounghoresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, v.65, no.9, pp.6839 - 6849, 2018-09

3

Thin Hybrid Metamaterial Slab With Negative and Zero Permeability for High Efficiency and Low Electromagnetic Field in Wireless Power Transfer Systems

Cho, Yeonje; Lee, Seongsoo; Kim, Dong-Hyun; Kim, Hongseok; Song, Chiuk; Kong, Sunkyu; Park, Junyong; Seo, Chulhun; Kim, JounghoresearcherIEEE Electromagnetic Compatibility SocietyIEEE Transactions on Electromagnetic Compatibility, v.60, no.4, pp.1001 - 1009, 2018-08

4

Design of an On-Silicon-Interposer Passive Equalizer for Next Generation High Bandwidth Memory With Data Rate Up To 8 Gb/s

Jeon, Yeseul; Kim, Heegon; Kim, Jounghoresearcher; Je, MinkyuresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, v.65, no.7, pp.2293 - 2303, 2018-07

5

Miniaturized and high-performance RF packages with ultra-thin glass substrates

Kim, Min Suk; Pulugurtha, Markondeya Raj; Kim, Youngwoo; Park, Gap Yeol; Cho, Kyungjun; Smet, Vanessa; Sundaram, Venky; Kim, Jounghoresearcher; Tummala, RaoELSEVIER SCI LTDMICROELECTRONICS JOURNAL, v.77, pp.66 - 72, 2018-07

6

Modeling, Measurement, and Analysis of Audio Frequency Ground Integrity for a TDMA Smartphone System

Park, Shinyoung; Song, Jinwook; Kim, Subin; Kim, Youngwoo; Lee, Man Ho; Kim, JounghoresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE Transactions on Components, Packaging and Manufacturing Technology, v.8, no.4, pp.519 - 530, 2018-04

7

High-Resolution Synthesized Magnetic Field Focusing for RF Barcode Applications

Min-Woo Kim; Ji H. Kim; Yeonje Cho; Minsik Kim; Bo H. Choi; Lee, Kwy-Roresearcher; Kim, Jounghoresearcher; Cho, Gyu-Hyeongresearcher; Rim, Chun TaekresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, v.65, no.1, pp.597 - 607, 2018-01

8

Localization of Short and Open Defects in Multilayer Through Silicon Vias (TSV) Daisy-Chain Structures

Piersanti, Stefano; de Paulis, Francesco; Olivieri, Carlo; Jung, Daniel Hyunsuk; Kim, Jounghoresearcher; Orlandi, AntonioIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.5, pp.1558 - 1564, 2017-10

9

Glass-Interposer Electromagnetic Bandgap Structure With Defected Ground Plane for Broadband Suppression of Power/Ground Noise Coupling

Kim, Youngwoo; Cho, Jonghyun; Cho, Kyungjun; Park, Junyong; Kim, Subin; Kim, Dong-Hyun; Park, Gapyeol; Sitaraman, Srikrishna; Raj, Pulugurtha Markondeya; Tummala, Rao R.; Kim, JounghoresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.9, pp.1493 - 1505, 2017-09

10

Miniaturized Bandpass Filters as Ultrathin 3-D IPDs and Embedded Thinfilms in 3-D Glass Modules

Sitaraman, Srikrishna; Sukumaran, Vijay; Pulugurtha, Markondeya Raj; Wu, Zihan; Suzuki, Yuya; Kim, Youngwoo; Sundaram, Venky; Kim, Jounghoresearcher; Tummala, Rao R.IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.9, pp.1410 - 1418, 2017-09

11

Algorithm for Extracting Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling and Robustness Analysis

Piersanti, Stefano; Pellegrino, Enza; de Paulis, Francesco; Orlandi, Antonio; Jung, Daniel Hyunsuk; Kim, Dong-Hyun; Kim, Jounghoresearcher; Fan, JunIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.4, pp.1329 - 1338, 2017-08

12

Signal Integrity Design and Analysis of a Multilayer Test Interposer for LPDDR4 Memory Test With Silicone Rubber-Based Sheet Contact

Kim, Jonghoon J.; Kim, Hee-Gon; Jung, Daniel Hyunsuk; Choi, Sumin; Lim, Jaemin; Kim, Youngwoo; Park, Junyong; Kim, Hyesoo; Ha, Dongho; Bae, Michael; Kim, JounghoresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.4, pp.1239 - 1251, 2017-08

13

High-Frequency Modeling and Signal Integrity Analysis of a Silicone Rubber Socket for High-Performance Package

Kim, Hyesoo; Kim, Jonghoon J.; Park, Junyong; Park, Shinyoung; Choi, Sumin; Bae, Bumhee; Ha, DongHo; Bae, Michael; Kim, JounghoresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1356 - 1368, 2017-08

14

Application of Machine Learning for Optimization of 3-D Integrated Circuits and Systems

Park, Sung Joo; Bae, Bumhee; Kim, Jounghoresearcher; Swaminathan, MadhavanIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, v.25, no.6, pp.1856 - 1865, 2017-06

15

Through-Silicon Via Capacitance-Voltage Hysteresis Modeling for 2.5-D and 3-D IC

Kim, Dong-Hyun; Kim, Youngwoo; Cho, Jong-Hyun; Bae, Bumhee; Park, Junyong; Lee, Hyunsuk; Lim, Jaemin; Kim, Jonghoon J.; Piersanti, Stefano; de Paulis, Francesco; Orlandi, Antonio; Kim, JounghoresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.6, pp.925 - 935, 2017-06

16

Through-Silicon Via (TSV) Capacitance-Voltage (CV) Hysteresis Modeling for 2.5D and 3D IC

Kim, Dong-Hyun; Kim, Youngwoo; Cho, Jounghyun; Bae, Bumhee; Park, Junyong; Lee, Hyunsuk; Lim, Jaemin; Kim, JounghoresearcherIEEE Transactions on Components, Packaging and Manufacturing TechnologyIEEE Transactions on Components, Packaging and Manufacturing Technology, v.7, no.6, pp.925 - 935, 2017-06

17

Glass Interposer Electromagnetic Bandgap Structure for Efficient Suppression of Power/Ground Noise Coupling

Kim, Youngwoo; Cho, Jonghyun; Kim, Jonghoon J.; Cho, Kyungjun; Kim, Subin; Sitaraman, Srikrishna; Sundaram, Venky; Raj, Pulugurtha Markondeya; Tummala, Rao R.; Kim, JounghoresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.3, pp.940 - 951, 2017-06

18

An Efficient Crosstalk-Included Eye-Diagram Estimation Method for High-Speed Interposer Channel on 2.5-D and 3-D IC

Choi, Sumin; Kim, Hee-Gon; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Lim, Jaemin; Kim, JounghoresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.3, pp.927 - 939, 2017-06

19

Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis

Jung, Daniel Hyunsuk; Kim, Youngwoo; Kim, Jonghoon J.; Kim, Heegon; Choi, Sumin; Song, Yoon-Ho; Bae, Hyun-Cheol; Choi, Kwang-Seong; Piersanti, Stefano; de Paulis, Francesco; Orlandi, Antonio; Kim, JounghoresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.1, pp.138 - 152, 2017-01

20

Measurement and Analysis of Glass Interposer Power Distribution Network Resonance Effects on a High-Speed Through Glass Via Channel

Kim, Youngwoo; Cho, Jonghyun; Kim, Jonghoon J.; Kim, Kiyeong; Cho, Kyungjun; Kim, Subin; Sitaraman, Srikrishna; Sundaram, Venky; Raj, Pulugurtha Markondeya; Tummala, Rao; Kim, JounghoresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.58, no.6, pp.1747 - 1759, 2016-12

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