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Paik, Kyung-Wook (백경욱) C-1536-2011

Department
Department of Materials Science & Engineering(신소재공학과)
Website
http://npil.kaist.ac.krHomePage
Research Area

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1

Effects of the Types of Anisotropic Conductive Films on the Bending Reliability of Chip-in-Plastic Packages

Kim, Ji-Hyun; Kim, Ji-Hye; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.3, pp.405 - 411, 2019-03

2

A Study on the Conductive Particle Movements in Polyvinylidene Fluoride Anchoring Polymer Layer Anisotropic Conductive Films for 20-mu m Fine-Pitch Interconnection

Lee, Sang-Hoon; Yoon, Dal-Jin; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.2, pp.209 - 215, 2019-02

3

The Effect of the Thermal Mechanical Properties of Nonconductive Films on the Thermal Cycle Reliability of 40-mu m Fine Pitch Cu-Pillar/Ni/SnAg Microbump Flip-Chip Assembly

Lee, SeYong; Park, JongHo; Park, Jae-Hyeong; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.1, pp.10 - 17, 2019-01

4

Effects of the Nylon Anchoring Polymer Layer on the Conductive Particle Movements of Anisotropic Conductive Films for Ultrafine Pitch Chip-on-Glass Applications

Yoon, Dal Jin; Lee, Sang-Hoon; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.10, pp.1723 - 1728, 2018-10

5

Effects of Flux Activator Addition in Nanofiber/Solder Anisotropic Conductive Films (ACFs) on the Solder Wettability of Flex-on-Flex (FOF) Assembly

Lee, Ji-Soo; Kim, Ji-Hye; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.7, pp.1316 - 1322, 2018-07

6

Novel dielectric BN/epoxy nanocomposites with enhanced heat dissipation performance for electronic packaging

Lee, Dongju; Lee, Seyong; Byun, Segi; et al, COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, v.107, pp.217 - 223, 2018-04

7

A Study on the Optimization of Anisotropic Conductive Films for Sn-3Ag-0.5Cu-Based Flex-on-Board Application at a 250 degrees C Bonding Temperature

Zhang, Shuye; Yang, Ming; Wu, Yang; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.3, pp.383 - 391, 2018-03

8

Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers

Zhang, Shuye; Yang, Ming; Jin, Ming Liang; et al, METALS, v.8, no.1, 2018-01

9

A Study on the Bonding Conditions and Nonconductive Filler Contents on Cationic Epoxy-Based Sn-58Bi Solder ACFs Joints for Reliable Flex-on-Board Applications

Zhang, Shuye; Lin, Tiesong; He, Peng; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.12, pp.2087 - 2094, 2017-12

10

Effects of acrylic adhesives property and optimized bonding parameters on Sn-58Bi solder joint morphology for flex-on-board assembly

Zhang, Shuye; Lin, Tiesong; He, Peng; et al, MICROELECTRONICS RELIABILITY, v.78, pp.181 - 189, 2017-11

11

The Effect of Anisotropic Conductive Films Adhesion on the Bending Reliability of Chip-in-Flex Packages for Wearable Electronics Applications

Kim, Ji-Hye; Lee, Tae-Ik; Kim, Taek-Sooresearcher; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.10, pp.1583 - 1591, 2017-10

12

A study on Flex-on-Fabric (FOF) Interconnection Using Anisotropic Conductive Films (ACFs) and Ultrasonic Bonding Method

Jung, Seung-Yoon; Hong, Hye-Eun; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1265 - 1271, 2017-08

13

Wafer-Level Double-Layer Nonconductive Films for Flip-Chip Assembly

Lee, Seyong; Lee, HanMin; Shin, Ji Won; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1258 - 1264, 2017-08

14

Effects of Thermocompression Bonding Parameters on Cu Pillar/Sn-Ag Microbump Solder Joint Morphology Using Nonconductive Films

Lee, Hyeong Gi; Shin, Ji Won; Choi, Yong-Won; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.3, pp.450 - 455, 2017-03

15

Moisture Effects on NCF Adhesion and Solder Joint Reliability of Chip-on-Board Assembly Using Cu Pillar/Sn-Ag Microbump

Kim, Youngsoon; Yoon, Taeshik; Kim, Tae-Wan; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.3, pp.371 - 378, 2017-03

16

Strength dependence of epoxy composites on the average filler size of non-oxidized graphene flake

Kim, Jin; Kim, Jungmo; Song, Sungho; et al, CARBON, v.113, pp.379 - 386, 2017-03

17

A Study on the Nanofiber-Sheet Anisotropic Conductive Films (NS-ACFs) for Ultra-Fine-Pitch Interconnection Applications

Lee, Sang Hoon; Paik, Kyung-Wookresearcher, JOURNAL OF ELECTRONIC MATERIALS, v.46, no.1, pp.167 - 174, 2017-01

18

Joint Morphologies and Failure Mechanisms of Anisotropic Conductive Films (ACFs) During a Power Handling Capability Test for Flex-On-Board Applications

Zhang, Shuye; Park, Jae-Hyeong; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.12, pp.1820 - 1826, 2016-12

19

Effect of Nanofiber Orientation on Nanofiber Solder Anisotropic Conductive Films Joint Properties and Bending Reliability of Flex-on-Flex Assembly

Kim, Tae-Wan; Lee, Tae-Ik; Pan, Yan; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.9, 2016-09

20

Effects of Polymer Ball Size and Polyvinylidene Fluoride Nanofiber on the Ball Capture Rate for 100-mu m-Pitch Flex-on-Flex Assembly Using Anisotropic Conductive Films and Ultrasonic Bonding Method

Park, Jae-Hyeong; Kim, Tae Wan; Zhang, Shuye; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.7, pp.1127 - 1134, 2016-07

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