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Paik, Kyung-Wook (백경욱) C-1536-2011

Department
Department of Materials Science & Engineering(신소재공학과)
Co-author
Collaboration Network Collaboration Network
Website
http://npil.kaist.ac.krHomePage
Research Area

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1

Effects of Flux Activator Addition in Nanofiber/Solder Anisotropic Conductive Films (ACFs) on the Solder Wettability of Flex-on-Flex (FOF) Assembly

Lee, Ji-Soo; Kim, Ji-Hye; Paik, Kyung-WookresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.7, pp.1316 - 1322, 2018-07

2

A Study on the Optimization of Anisotropic Conductive Films for Sn-3Ag-0.5Cu-Based Flex-on-Board Application at a 250 degrees C Bonding Temperature

Zhang, Shuye; Yang, Ming; Wu, Yang; Du, Jikun; Lin, Tiesong; He, Peng; Huang, Mingliang; Paik, Kyung-WookresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.3, pp.383 - 391, 2018-03

3

Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers

Zhang, Shuye; Yang, Ming; Jin, Ming Liang; Huang, Wen-Can; Lin, Tiesong; He, Peng; Lin, Panpan; Paik, Kyung-WookresearcherMDPIMETALS, v.8, no.1, 2018-01

4

A Study on the Bonding Conditions and Nonconductive Filler Contents on Cationic Epoxy-Based Sn-58Bi Solder ACFs Joints for Reliable Flex-on-Board Applications

Zhang, Shuye; Lin, Tiesong; He, Peng; Zhao, Ning; Huang, Mingliang; Paik, Kyung-WookresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.12, pp.2087 - 2094, 2017-12

5

Effects of acrylic adhesives property and optimized bonding parameters on Sn-58Bi solder joint morphology for flex-on-board assembly

Zhang, Shuye; Lin, Tiesong; He, Peng; Paik, Kyung-WookresearcherPERGAMON-ELSEVIER SCIENCE LTDMICROELECTRONICS RELIABILITY, v.78, pp.181 - 189, 2017-11

6

The Effect of Anisotropic Conductive Films Adhesion on the Bending Reliability of Chip-in-Flex Packages for Wearable Electronics Applications

Kim, Ji-Hye; Lee, Tae-Ik; Kim, Taek-Sooresearcher; Paik, Kyung-WookresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.10, pp.1583 - 1591, 2017-10

7

A study on Flex-on-Fabric (FOF) Interconnection Using Anisotropic Conductive Films (ACFs) and Ultrasonic Bonding Method

Jung, Seung-Yoon; Hong, Hye-Eun; Paik, Kyung-WookresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1265 - 1271, 2017-08

8

Wafer-Level Double-Layer Nonconductive Films for Flip-Chip Assembly

Lee, Seyong; Lee, HanMin; Shin, Ji Won; Kim, Woojeong; Choi, Taejin; Paik, Kyung-WookresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1258 - 1264, 2017-08

9

Strength dependence of epoxy composites on the average filler size of non-oxidized graphene flake

Kim, Jin; Kim, Jungmo; Song, Sungho; Zhang, Shuye; Cha, Jaemin; Kim, Kisun; Yoon, Hyewon; Jung, Yeonwoong; Paik, Kyung-Wookresearcher; Jeon, SeokwooresearcherPERGAMON-ELSEVIER SCIENCE LTDCARBON, v.113, pp.379 - 386, 2017-03

10

Moisture Effects on NCF Adhesion and Solder Joint Reliability of Chip-on-Board Assembly Using Cu Pillar/Sn-Ag Microbump

Kim, Youngsoon; Yoon, Taeshik; Kim, Tae-Wan; Kim, Taek-Sooresearcher; Paik, Kyung-WookresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.3, pp.371 - 378, 2017-03

11

Effects of Thermocompression Bonding Parameters on Cu Pillar/Sn-Ag Microbump Solder Joint Morphology Using Nonconductive Films

Lee, Hyeong Gi; Shin, Ji Won; Choi, Yong-Won; Paik, Kyung-WookresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.3, pp.450 - 455, 2017-03

12

A Study on the Nanofiber-Sheet Anisotropic Conductive Films (NS-ACFs) for Ultra-Fine-Pitch Interconnection Applications

Lee, Sang Hoon; Paik, Kyung-WookresearcherSPRINGERJOURNAL OF ELECTRONIC MATERIALS, v.46, no.1, pp.167 - 174, 2017-01

13

Joint Morphologies and Failure Mechanisms of Anisotropic Conductive Films (ACFs) During a Power Handling Capability Test for Flex-On-Board Applications

Zhang, Shuye; Park, Jae-Hyeong; Paik, Kyung-WookresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.12, pp.1820 - 1826, 2016-12

14

Effect of Nanofiber Orientation on Nanofiber Solder Anisotropic Conductive Films Joint Properties and Bending Reliability of Flex-on-Flex Assembly

Kim, Tae-Wan; Lee, Tae-Ik; Pan, Yan; Kim, Wansun; Zhang, Shuye; Kim, Taek-Sooresearcher; Paik, Kyung-WookresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.9, 2016-09

15

Effects of Polymer Ball Size and Polyvinylidene Fluoride Nanofiber on the Ball Capture Rate for 100-mu m-Pitch Flex-on-Flex Assembly Using Anisotropic Conductive Films and Ultrasonic Bonding Method

Park, Jae-Hyeong; Kim, Tae Wan; Zhang, Shuye; Paik, Kyung-WookresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.7, pp.1127 - 1134, 2016-07

16

Effects of PCB Pad Metal Finishes on the Cu-Pillar/Sn-Ag Micro Bump Joint Reliability of Chip-on-Board (COB) Assembly

Kim, Youngsoon; Lee, Seyong; Shin, Ji Won; Paik, Kyung-WookresearcherSPRINGERJOURNAL OF ELECTRONIC MATERIALS, v.45, no.6, pp.3208 - 3219, 2016-06

17

Effects of the Mechanical Properties of Polymer Resin and the Conductive Ball Types of Anisotropic Conductive Films on the Bending Properties of Chip-in-Flex Package

Kim, Young-Lyong; Lee, Tae-Ik; Kim, Ji-Hye; Kim, Wonsik; Kim, Taek-Sooresearcher; Paik, Kyung-WookresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.2, pp.200 - 207, 2016-02

18

Bending Properties of Anisotropic Conductive Films Assembled Chip-in-Flex Packages for Wearable Electronics Applications

Kim, Ji-Hye; Lee, Tae-Ik; Shin, Ji Won; Kim, Taek-Sooresearcher; Paik, Kyung-WookresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.2, pp.208 - 215, 2016-02

19

A Study on the Failure Mechanism and Enhanced Reliability of Sn58Bi Solder Anisotropic Conductive Film Joints in a Pressure Cooker Test Due to Polymer Viscoelastic Properties and Hydroswelling

Zhang, Shuye; Paik, Kyung-WookresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.2, pp.216 - 223, 2016-02

20

B-Stage Graphene-Epoxy Composite Films: Effects of film viscosity changes on the electric field-induced alignment of graphene flakes

Jung, Seung-Yoon; Paik, Kyung-WookresearcherInstitute of Electrical and Electronics EngineersIEEE NANOTECHNOLOGY MAGAZINE, v.9, no.4, pp.13 - 18, 2015-12

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