Researcher Page

사진

Paik, Kyung-Wook (백경욱) C-1536-2011

Department
Department of Materials Science & Engineering(신소재공학과)
Co-author
Collaboration Network Collaboration Network
Website
http://npil.kaist.ac.krHomePage
Research Area

Keyword Cloud

Reload 더보기
1

Strength dependence of epoxy composites on the average filler size of non-oxidized graphene flake

Kim, Jin; Kim, Jungmo; Song, Sungho; Zhang, Shuye; Cha, Jaemin; Kim, Kisun; Yoon, Hyewon; Jung, Yeonwoong; Paik, Kyung-Wookresearcher; Jeon, SeokwooresearcherPERGAMON-ELSEVIER SCIENCE LTDCARBON, v.113, pp.379 - 386, 2017-03

2

Moisture Effects on NCF Adhesion and Solder Joint Reliability of Chip-on-Board Assembly Using Cu Pillar/Sn-Ag Microbump

Kim, Youngsoon; Yoon, Taeshik; Kim, Tae-Wan; Kim, Taek-Sooresearcher; Paik, Kyung-WookresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.3, pp.371 - 378, 2017-03

3

Effects of Thermocompression Bonding Parameters on Cu Pillar/Sn-Ag Microbump Solder Joint Morphology Using Nonconductive Films

Lee, Hyeong Gi; Shin, Ji Won; Choi, Yong-Won; Paik, Kyung-WookresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.3, pp.450 - 455, 2017-03

4

A Study on the Nanofiber-Sheet Anisotropic Conductive Films (NS-ACFs) for Ultra-Fine-Pitch Interconnection Applications

Lee, Sang Hoon; Paik, Kyung-WookresearcherSPRINGERJOURNAL OF ELECTRONIC MATERIALS, v.46, no.1, pp.167 - 174, 2017-01

5

Joint Morphologies and Failure Mechanisms of Anisotropic Conductive Films (ACFs) During a Power Handling Capability Test for Flex-On-Board Applications

Zhang, Shuye; Park, Jae-Hyeong; Paik, Kyung-WookresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.12, pp.1820 - 1826, 2016-12

6

Effect of Nanofiber Orientation on Nanofiber Solder Anisotropic Conductive Films Joint Properties and Bending Reliability of Flex-on-Flex Assembly

Kim, Tae-Wan; Lee, Tae-Ik; Pan, Yan; Kim, Wansun; Zhang, Shuye; Kim, Taek-Sooresearcher; Paik, Kyung-WookresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.9, 2016-09

7

Effects of Polymer Ball Size and Polyvinylidene Fluoride Nanofiber on the Ball Capture Rate for 100-mu m-Pitch Flex-on-Flex Assembly Using Anisotropic Conductive Films and Ultrasonic Bonding Method

Park, Jae-Hyeong; Kim, Tae Wan; Zhang, Shuye; Paik, Kyung-WookresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.7, pp.1127 - 1134, 2016-07

8

Effects of PCB Pad Metal Finishes on the Cu-Pillar/Sn-Ag Micro Bump Joint Reliability of Chip-on-Board (COB) Assembly

Kim, Youngsoon; Lee, Seyong; Shin, Ji Won; Paik, Kyung-WookresearcherSPRINGERJOURNAL OF ELECTRONIC MATERIALS, v.45, no.6, pp.3208 - 3219, 2016-06

9

A Study on the Failure Mechanism and Enhanced Reliability of Sn58Bi Solder Anisotropic Conductive Film Joints in a Pressure Cooker Test Due to Polymer Viscoelastic Properties and Hydroswelling

Zhang, Shuye; Paik, Kyung-WookresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.2, pp.216 - 223, 2016-02

10

Effects of the Mechanical Properties of Polymer Resin and the Conductive Ball Types of Anisotropic Conductive Films on the Bending Properties of Chip-in-Flex Package

Kim, Young-Lyong; Lee, Tae-Ik; Kim, Ji-Hye; Kim, Wonsik; Kim, Taek-Sooresearcher; Paik, Kyung-WookresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.2, pp.200 - 207, 2016-02

11

Bending Properties of Anisotropic Conductive Films Assembled Chip-in-Flex Packages for Wearable Electronics Applications

Kim, Ji-Hye; Lee, Tae-Ik; Shin, Ji Won; Kim, Taek-Sooresearcher; Paik, Kyung-WookresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.2, pp.208 - 215, 2016-02

12

B-Stage Graphene-Epoxy Composite Films: Effects of film viscosity changes on the electric field-induced alignment of graphene flakes

Jung, Seung-Yoon; Paik, Kyung-WookresearcherInstitute of Electrical and Electronics EngineersIEEE NANOTECHNOLOGY MAGAZINE, v.9, no.4, pp.13 - 18, 2015-12

13

Wafer-Level Packages Using B-Stage Nonconductive Films for Cu Pillar/Sn-Ag Microbump Interconnection

Lee, Hyeong Gi; Choi, Yong-Won; Shin, Ji Won; Paik, Kyung-WookresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.11, pp.1567 - 1572, 2015-11

14

Nanofiber Anisotropic Conductive Films (ACF) for Ultra-Fine-Pitch Chip-on-Glass (COG) Interconnections

Lee, Sang Hoon; Kim, Tae-Wan; Suk, Kyung-Lim; Paik, Kyung-WookresearcherSPRINGERJOURNAL OF ELECTRONIC MATERIALS, v.44, no.11, pp.4628 - 4636, 2015-11

15

Effects of Bonding Pressures and Bonding Temperatures on Solder Joint Morphology and Reliability of Solder ACF Bonding

Kim, Yoo Sun; Kim, Seung-Ho; Shin, Ji Won; Paik, Kyung-WookresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.9, pp.1350 - 1357, 2015-09

16

Effects of Curing Agent and Curing Temperature on Material Properties of Epoxy/BaTiO3 Composite Embedded Capacitor Films

Lee, Hyeong Gi; Paik, Kyung-WookresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE Transactions on Components Packaging and Manufacturing Technology, v.5, no.4, pp.451 - 459, 2015-04

17

Highly Reliable Solder ACFs FOB (Flex-on-Board) Interconnection Using Ultrasonic Bonding

김유선; Zhang Shuye; 백경욱researcher한국마이크로전자및패키징학회마이크로전자 및 패키징학회지, v.22, no.1, pp.35 - 41, 2015-03

18

Non-conductive film with Zn-nanoparticles (Zn-NCF) for 40 mu m pitch Cu-pillar/Sn-Ag bump interconnection

Shin, Ji Won; Kim, Il; Choi, Yong-Won; Kim, Youngsoon; Kang, Un Byung; Jee, Young Kun; Paik, Kyung-WookresearcherPERGAMON-ELSEVIER SCIENCE LTDMICROELECTRONICS RELIABILITY, v.55, no.2, pp.432 - 441, 2015-02

19

Effect of Flux Activators on the Solder Wettability of Solder Anisotropic Conductive Films

Kim, Seung-Ho; Choi, Yongwon; Kim, Yoo Sun; Paik, Kyung-WookresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.1, pp.3 - 8, 2015-01

20

A Study on the Solder Ball Size and Content Effects of Solder ACFs for Flex-on-Board Assembly Applications Using Ultrasonic Bonding

Zhang, Shuye; Kim, Seung-Ho; Kim, Tae-Wan; Kim, Yoo Sun; Paik, Kyung-WookresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.1, pp.9 - 14, 2015-01

Load more items
Loading...

rss_1.0 rss_2.0 atom_1.0