Electrical Characterization of Screen-Printed Circuits on the Fabric

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dc.contributor.authorKim, Yongsangko
dc.contributor.authorKim, Hyejungko
dc.contributor.authorYoo, Hoi-Junko
dc.date.accessioned2013-03-11T06:54:48Z-
dc.date.available2013-03-11T06:54:48Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2010-02-
dc.identifier.citationIEEE TRANSACTIONS ON ADVANCED PACKAGING, v.33, pp.196 - 205-
dc.identifier.issn1521-3323-
dc.identifier.urihttp://hdl.handle.net/10203/98587-
dc.description.abstractFabrication methods of planar printed circuits on fabrics are introduced and their electrical characteristics are measured and analyzed. Wet patterning method like screen printing as well as dry process of sputtering are used to fabricate the patterned film electrodes on various types of fabrics. The minimum width of the patterns is 0.2 mm for screen printing and 0.1 mm for gold sputtering, and the typical sheet resistance is 134 m Omega/square. Fabrication methods of capacitors of 1 pF-1 nF and inductors of 500 nH-1 mu H at 10 MHz on the fabrics are also introduced. Bonding and packaging of silicon chip directly on the fabric circuit board are proposed and their mechanical properties are investigated. The ac impedance of the transmission line is measured as 201-215 with <7.4% variation, and the time-domain reflectometry profile shows that the -3 dB frequency of the printed transmission line of 15 cm on the fabric is 80 MHz. A complete system composed of a fabric capacitor sensor input, a controller system-on-a-chip, and an LED array display is implemented on the fabric and its operation is demonstrated successfully.-
dc.languageEnglish-
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC-
dc.subjectTEXTILES-
dc.subjectDESIGN-
dc.titleElectrical Characterization of Screen-Printed Circuits on the Fabric-
dc.typeArticle-
dc.identifier.wosid000278318800023-
dc.identifier.scopusid2-s2.0-77949275831-
dc.type.rimsART-
dc.citation.volume33-
dc.citation.beginningpage196-
dc.citation.endingpage205-
dc.citation.publicationnameIEEE TRANSACTIONS ON ADVANCED PACKAGING-
dc.identifier.doi10.1109/TADVP.2009.2034536-
dc.contributor.localauthorYoo, Hoi-Jun-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorE-textile-
dc.subject.keywordAuthorfabric-
dc.subject.keywordAuthorelectrical characterization of fabric-
dc.subject.keywordAuthorpackaging-
dc.subject.keywordAuthorplanar-fashionable circuit board (P-FCB)-
dc.subject.keywordAuthorsilk-screen printing-
dc.subject.keywordAuthorsputtering-
dc.subject.keywordAuthortransmission lines-
dc.subject.keywordAuthorwearable computing-
dc.subject.keywordPlusTEXTILES-
dc.subject.keywordPlusDESIGN-
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