DC Field | Value | Language |
---|---|---|
dc.contributor.author | Jung, Jae-Ryung | ko |
dc.contributor.author | Yum, Bong-Jin | ko |
dc.date.accessioned | 2013-03-11T06:12:47Z | - |
dc.date.available | 2013-03-11T06:12:47Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2011-05 | - |
dc.identifier.citation | INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, v.54, no.5-8, pp.619 - 628 | - |
dc.identifier.issn | 0268-3768 | - |
dc.identifier.uri | http://hdl.handle.net/10203/98479 | - |
dc.description.abstract | In this paper, the relationship between the uniformity measure (U) and the Taguchi signal-to-noise ratio (SNR) for parameter design (or robust design) is investigated with a focus on the deposition process. For the static parameter design, it can be easily shown that U is directly related to the Taguchi SNR, and, as such, U can be interpreted as a measure directly related to the expected loss after the mean thickness is adjusted to the target. For the dynamic parameter design in which the target of a characteristic (e.g., the target thickness for a deposition process) changes, the Taguchi SNR is conditional on the signal parameter values (e.g., the deposition times) used in the parameter design experiment. Therefore, a new performance measure is developed considering a general distribution of the target thickness, and it is shown that U is also equivalent to this new performance measure. In summary, U can be used as a valid performance measure for the dynamic as well as static parameter design of a deposition process. Based on these findings, static and dynamic parameter design procedures for a deposition process are developed considering not only U but also the deposition rate, and the proposed dynamic procedure is illustrated with an example case study. | - |
dc.language | English | - |
dc.publisher | SPRINGER LONDON LTD | - |
dc.subject | ROBUST DESIGN | - |
dc.subject | SILICON-NITRIDE | - |
dc.subject | OPTIMIZATION | - |
dc.title | Uniformity and signal-to-noise ratio for static and dynamic parameter designs of deposition processes | - |
dc.type | Article | - |
dc.identifier.wosid | 000290164500017 | - |
dc.identifier.scopusid | 2-s2.0-79955657468 | - |
dc.type.rims | ART | - |
dc.citation.volume | 54 | - |
dc.citation.issue | 5-8 | - |
dc.citation.beginningpage | 619 | - |
dc.citation.endingpage | 628 | - |
dc.citation.publicationname | INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY | - |
dc.contributor.localauthor | Yum, Bong-Jin | - |
dc.contributor.nonIdAuthor | Jung, Jae-Ryung | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | Uniformity | - |
dc.subject.keywordAuthor | Signal-to-noise ratio | - |
dc.subject.keywordAuthor | Parameter design | - |
dc.subject.keywordAuthor | Robust design | - |
dc.subject.keywordAuthor | Deposition process | - |
dc.subject.keywordPlus | ROBUST DESIGN | - |
dc.subject.keywordPlus | SILICON-NITRIDE | - |
dc.subject.keywordPlus | OPTIMIZATION | - |
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