Heterogeneous integration of InGaAsP microdisk laser on a silicon platform using optofluidic assembly

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Heterogeneous integration of InGaAsP microdisk lasers on a silicon platform is demonstrated experimentally using an optofluidic assembly technique. The 200-nm-thick, 5- and 10-mu m-diameter microdisk lasers are fabricated on InP and then released from the substrates. They are reassembled on a silicon platform using lateral-field optoelectronic tweezers (LOET). The assembled laser with 5-mu m diameter exhibits a threshold pump power of 340 mu W at room temperature under pulse condition. The heterogeneously-integrated InGaAsP-on-Si microdisk laser could provide the much needed optical source for CMOS-based silicon photonics. The small footprint and low power consumption make them attractive for optical interconnect applications. The optofluidic assembly technique enables efficient use of the III-V epitaxial materials in silicon photonic integrated circuits.
Publisher
SPRINGER
Issue Date
2009-06
Language
English
Article Type
Article
Keywords

STRIP WAVE-GUIDES; OPTICAL INTERCONNECTS

Citation

APPLIED PHYSICS A-MATERIALS SCIENCE PROCESSING, v.95, no.4, pp.967 - 972

ISSN
0947-8396
DOI
10.1007/s00339-009-5125-2
URI
http://hdl.handle.net/10203/97006
Appears in Collection
EE-Journal Papers(저널논문)
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