Broadband InGaAs PIN Traveling-Wave Switch Using a BCB-Based Thin-Film Microstrip Line Structure

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This letter describes the design and fabrication of a broadband InGaAs PIN traveling wave switch. A new thin-film microstrip line structure integrated with InGaAs PIN diodes has been used to enhance the switch performance at higher frequencies. The developed InGaAs PIN switch has an insertion loss of less than 3.2 dB and an isolation of greater than 40 dB in a broadband frequency range from 25 to 95 GHz. The BCB-based multilayer technology effectively reduces the chip size of the fabricated SPDT MMIC switch to 1.05 x 0.58 mm(2). To our knowledge, this is the first InGaAs PIN traveling-wave switch demonstrated up to 95 GHz.
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Issue Date
2009-10
Language
English
Article Type
Article
Keywords

FET

Citation

IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.19, no.10, pp.647 - 649

ISSN
1531-1309
DOI
10.1109/LMWC.2009.2029745
URI
http://hdl.handle.net/10203/95535
Appears in Collection
EE-Journal Papers(저널논문)
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