X-band high-power HEMT SPDT switch with selectively anodised aluminium substrate

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dc.contributor.authorYeo, S. K.ko
dc.contributor.authorKwon, Young Seko
dc.date.accessioned2013-03-08T17:31:11Z-
dc.date.available2013-03-08T17:31:11Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2010-11-
dc.identifier.citationELECTRONICS LETTERS, v.46, no.24, pp.1627 - 1628-
dc.identifier.issn0013-5194-
dc.identifier.urihttp://hdl.handle.net/10203/93758-
dc.description.abstractA high-power HEMT single-pole double-throw (SPDT) switch is introduced, based on a multichip module structure with a selectively anodised aluminium substrate. The proposed high-power SPDT switch uses thick anodised aluminium (Al(2)O(3)) layers and bare high-power HEMTs directly mounted on an aluminium substrate for an effective heatsink and high electrical isolation. A 4.4 x 3.1 mm compact high-power SPDT switch for X-band phased array applications is demonstrated. The fabricated X-band SPDT switch has a measured insertion loss of less than 1.3 dB and an isolation of 20.3 dB. In particular, the X-band switch exhibits an on-state power-handling capability that exceeds 35.5 dBm at a compression point of 1 dB. The experimental results suggest that the developed hybrid IC technology, which is based on selectively anodised aluminium, can be applied to high-power X-band SPDT switch applications.-
dc.languageEnglish-
dc.publisherINST ENGINEERING TECHNOLOGY-IET-
dc.titleX-band high-power HEMT SPDT switch with selectively anodised aluminium substrate-
dc.typeArticle-
dc.identifier.wosid000284584600035-
dc.identifier.scopusid2-s2.0-80053224138-
dc.type.rimsART-
dc.citation.volume46-
dc.citation.issue24-
dc.citation.beginningpage1627-
dc.citation.endingpage1628-
dc.citation.publicationnameELECTRONICS LETTERS-
dc.identifier.doi10.1049/el.2010.1929-
dc.contributor.localauthorKwon, Young Se-
dc.type.journalArticleArticle-
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