반도체 패키지용 이방성 전도성 접착제 기술의 최신 동향 Recent Advances in Anisotropic Conductive Adhesives for Microelectronics Packaging Applications

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Publisher
한국세라믹학회
Issue Date
2005-12
Language
KOR
Citation

세라미스트, v.8, no.6, pp.23 - 39

ISSN
1226-976X
URI
http://hdl.handle.net/10203/86270
Appears in Collection
NE-Journal Papers(저널논문)
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