DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Bun-Joong | ko |
dc.contributor.author | Ha, Man-Lyun | ko |
dc.contributor.author | Kwon, Young Se | ko |
dc.date.accessioned | 2013-03-06T07:15:50Z | - |
dc.date.available | 2013-03-06T07:15:50Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2006 | - |
dc.identifier.citation | JAPANESE JOURNAL OF APPLIED PHYSICS, v.45, no.8A, pp.6141 - 6145 | - |
dc.identifier.issn | 0021-4922 | - |
dc.identifier.uri | http://hdl.handle.net/10203/86243 | - |
dc.description.abstract | In this paper, we present the detailed fabrication process and high-frequency characterization of a new silicon through-wafer via interconnection and a low pass filter module flip-chip bonded to these via interconnections. An oxide liner of 18 mu m thick for the via was fabricated on a complementary metal-oxide-semi conductor (CMOS)-grade low-resistivity 5 Omega.cm silicon wafer using the oxidized porous silicon (OPS) process. The through-wafer vias were filled with copper by electroplating. For a via interconnection of 240 mu m length and 70 mu m diameter, the series inductance and resistance are 0.079 nH and 0.059 Omega each. A coplanar waveguide (CPW) and a RF low pass filter (LPF) module were assembled on this through-wafer via interconnection substrate. | - |
dc.language | English | - |
dc.publisher | Japan Soc Applied Physics | - |
dc.subject | COPLANAR WAVE-GUIDES | - |
dc.subject | SUBSTRATE | - |
dc.title | New through-wafer via interconnections with thick oxidized porous silicon sidewall via | - |
dc.type | Article | - |
dc.identifier.wosid | 000240512800017 | - |
dc.identifier.scopusid | 2-s2.0-33748528997 | - |
dc.type.rims | ART | - |
dc.citation.volume | 45 | - |
dc.citation.issue | 8A | - |
dc.citation.beginningpage | 6141 | - |
dc.citation.endingpage | 6145 | - |
dc.citation.publicationname | JAPANESE JOURNAL OF APPLIED PHYSICS | - |
dc.identifier.doi | 10.1143/JJAP.45.6141 | - |
dc.contributor.localauthor | Kwon, Young Se | - |
dc.contributor.nonIdAuthor | Kim, Bun-Joong | - |
dc.contributor.nonIdAuthor | Ha, Man-Lyun | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | through-wafer via interconnections | - |
dc.subject.keywordAuthor | oxidized porous silicon (OPS) | - |
dc.subject.keywordAuthor | LPF | - |
dc.subject.keywordAuthor | CPW | - |
dc.subject.keywordPlus | COPLANAR WAVE-GUIDES | - |
dc.subject.keywordPlus | SUBSTRATE | - |
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