Multiple-pulse laser annealing of preamorphized silicon for ultrashallow boron junction formation

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Advantages of multiple-pulse laser annealing with a moderate energy fluence over a single-pulse annealing with a high energy fluence are demonstrated on them formation of shallow p(+)/n junction. When the silicon surface is preamorphized, the multiple-pulse laser annealing with a fluence adjusted to a value which can melt the amorphous layer but not crystal silicon shows that the successive pulses do not increase junction depth further but decrease sheet resistance significantly. Under this condition, the junction depth is still controlled by the depth of the preamorphized layer. However, when the laser fluence is high enough to melt the crystal silicon, the successive pulses result in the deepening of junction depth. This is attributed to the increase of surface roughness by the successive pulses, thereby increasing the total absorbed energy. (C) 2003 American Vacuum Society.
Publisher
A V S AMER INST PHYSICS
Issue Date
2003
Language
English
Article Type
Article
Keywords

EXCIMER-LASER

Citation

JOURNAL OF VACUUM SCIENCE TECHNOLOGY B, v.21, no.2, pp.706 - 709

ISSN
1071-1023
DOI
10.1116/1.1547747
URI
http://hdl.handle.net/10203/82130
Appears in Collection
EE-Journal Papers(저널논문)
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