Fabrication of sub-10-nm silicon nanowire arrays by size reduction lithography

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A photolithography-based method capable of size reduction to produce sub-10-nm Si nanowire arrays on a wafer scale is described. By conformally depositing a material (silicon oxide or silicon) that has a different etching property over a lithographically defined sacrificial sidewall and selectively removing the sacrificial material, the sidewall material is preserved and can serve as nanopattern mask for further processing. The resolution of this method is not limited by photolithography but by the thickness of the material deposited. The application of size reduction nano-patterning method can range from the fabrication of biosensors to model catalyst systems.
Publisher
AMER CHEMICAL SOC
Issue Date
2003-04
Language
English
Article Type
Letter
Keywords

DIMENSIONAL THERMAL-OXIDATION; ELECTRON-BEAM LITHOGRAPHY; NANOSCALE CMOS; SPACER FINFET; TERABIT ERA; TECHNOLOGY; AREA

Citation

JOURNAL OF PHYSICAL CHEMISTRY B, v.107, no.15, pp.3340 - 3343

ISSN
1520-6106
DOI
10.1021/JP0222649
URI
http://hdl.handle.net/10203/82033
Appears in Collection
EE-Journal Papers(저널논문)
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