Studies of electroless nickel under bump metallurgy-solder interfacial reactions and their effects on flip chip solder joint reliability
A study on the electroless-deposited Ni-P under bump metallurgy (UBM) was performed for the fabrication of flip chip bumps. The interfacial reaction at the electroless Ni UBM/solder interface was investigated. The growth kinetics of the Ni-Sn intermetallic compounds (IMC) showed a rapid initial growth, followed by a reduced growth and a diffusion-controlled growth. Shear testing showed that the Ni UBM-Sn containing solder systems caused brittle bump failure, resulting in decreased bump adhesion strength.
- Issue Date
- 2002-05
- Language
- English
- Article Type
- Article; Proceedings Paper
- Keywords
NI-P; KINETICS
- Citation
JOURNAL OF ELECTRONIC MATERIALS, v.31, no.5, pp.520 - 528
- ISSN
- 0361-5235
- Appears in Collection
- MS-Journal Papers(저널논문)
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