Improvement of electrical properties of MOCVD HfO2 by multistep deposition

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A multistep metallorganic chemical vapor deposition (MOCVD) technique of HfO2 gate dielectric and its electrical properties are reported. This technique involves steps of "deposition followed by postdeposition annealing" of HfO2 in which each step is repeated on the previously deposited and annealed HfO2. Our experiment demonstrates significant reduction of gate leakage current after high-temperature annealing for HfO2 deposited using a multistep deposition technique as compared to conventional single-step deposition. This improvement is attributed to offset of the grain boundaries and pinholes from one layer to another in a multistep deposited HfO2 which eventually leads to blockage of leakage current path. (C) 2003 The Electrochemical Society.
Publisher
ELECTROCHEMICAL SOC INC
Issue Date
2003-11
Language
English
Article Type
Article
Citation

ELECTROCHEMICAL AND SOLID STATE LETTERS, v.6, no.11, pp.F42 - F44

ISSN
1099-0062
DOI
10.1149/1.1618071
URI
http://hdl.handle.net/10203/78623
Appears in Collection
EE-Journal Papers(저널논문)
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