Diffusion bonding of the textured Ni tapes for the substrate of YBCO coated conductors
Two pieces of the textured Ni tapes were diffusively bonded under mechanical pressure, 0.3 MPa at 1400 degrees C in a vacuum furnace. The cross-sectional view by SEM showed a good bonding without voids in the bonding line and the XRD measurements indicated it was still well textured. The buffer layer, CeO2, and the superconducting layer, YBCO, were successively deposited on the bonded tapes and were confirmed to be well textured. (C) 1998 Elsevier Science B.V. All rights reserved.
- Publisher
- ELSEVIER SCIENCE BV
- Issue Date
- 1998-09
- Language
- English
- Article Type
- Article
- Keywords
CRITICAL-CURRENT DENSITY; SUPERCONDUCTING TAPES; BUFFER LAYERS; GROWTH; FILMS; DEPOSITION; YBA2CU3O7
- Citation
PHYSICA C, v.305, no.3-4, pp.221 - 226
- ISSN
- 0921-4534
- Appears in Collection
- PH-Journal Papers(저널논문)
- Files in This Item
- There are no files associated with this item.
This item is cited by other documents in WoS
| ⊙ Detail Information in WoSⓡ | Click to see |  |
| ⊙ Cited 3 items in WoS | Click to see citing articles in |  |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.