Annealing behavior of gate oxide leakage current after quasi-breakdown

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dc.contributor.authorXu, Zko
dc.contributor.authorCho, Byung Jinko
dc.contributor.authorLi, MFko
dc.date.accessioned2013-03-02T14:03:24Z-
dc.date.available2013-03-02T14:03:24Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2000-10-
dc.identifier.citationMICROELECTRONICS RELIABILITY, v.40, pp.1341 - 1346-
dc.identifier.issn0026-2714-
dc.identifier.urihttp://hdl.handle.net/10203/73877-
dc.description.abstractAnnealing behavior of thin gate oxide alter quasi-breakdown (QB) has been investigated. The res;lt implies that the QB leakage current is consisted, of two components: the enhanced tunneling due to locally thinned oxide at interface-damaged region and the conduction through a shortening path. The change of leakage current during annealing is a competitive process of changes of these two components - the recovery of interface damage and the expansion of the shortening path in bulk oxide. A unified model is proposed to explain the mechanism of conduction in QB. (C) 2000 Elsevier Science Ltd. All rights reserved.-
dc.languageEnglish-
dc.publisherPERGAMON-ELSEVIER SCIENCE LTD-
dc.titleAnnealing behavior of gate oxide leakage current after quasi-breakdown-
dc.typeArticle-
dc.identifier.wosid000089532800017-
dc.identifier.scopusid2-s2.0-3342903803-
dc.type.rimsART-
dc.citation.volume40-
dc.citation.beginningpage1341-
dc.citation.endingpage1346-
dc.citation.publicationnameMICROELECTRONICS RELIABILITY-
dc.identifier.doi10.1016/S0026-2714(00)00129-3-
dc.contributor.localauthorCho, Byung Jin-
dc.contributor.nonIdAuthorXu, Z-
dc.contributor.nonIdAuthorLi, MF-
dc.type.journalArticleArticle; Proceedings Paper-
dc.subject.keywordPlusSOFT BREAKDOWN-
dc.subject.keywordPlusSTRESS-
dc.subject.keywordPlusQUASIBREAKDOWN-
dc.subject.keywordPlusRELIABILITY-
dc.subject.keywordPlusMECHANISM-
dc.subject.keywordPlusSILICON-
dc.subject.keywordPlusDEVICES-
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