실리콘 웨이퍼의 폴리싱 공정에서 웨이퍼 표면의 제거속도에 미치는 공정변수의 영향 Effect of process parameters on the removal rate of wafer surface in the polishing process of silicon wafer

Publisher
한국화학공학회
Issue Date
1998
Language
KOR
Citation

THEORIES AND APPLICATIONS OF CHEMICAL ENGINEERING, v.4, no.2, pp.3921-3924

URI
http://hdl.handle.net/10203/73617
Appears in Collection
NE-Journal Papers(저널논문)
Files in This Item
There are no files associated with this item.
  • Hit : 163
  • Download : 0
  • Cited 0 times in thomson ci

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0