HgCdTe 하이브리드 칩을 위한 인듐범프와 UBM에 관한 연구Study of Indium Bumps and UBM for HgCdTe Hybrid Chips
- Publisher
- 한국물리학회
- Issue Date
- 2000-10
- Language
- Korean
- Citation
새물리, v.41, no.4, pp.239 - 242
- ISSN
- 0374-4914
- Appears in Collection
- EE-Journal Papers(저널논문)
- Files in This Item
- There are no files associated with this item.
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