HgCdTe 하이브리드 칩을 위한 인듐범프와 UBM에 관한 연구 Study of Indium Bumps and UBM for HgCdTe Hybrid Chips

Publisher
한국물리학회
Issue Date
2000-10
Language
KOR
Citation

새물리, v.41, no.4, pp.239 - 242

ISSN
0374-4914
URI
http://hdl.handle.net/10203/73503
Appears in Collection
EE-Journal Papers(저널논문)
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