Browse "College of Engineering(공과대학)" by Type Conference

Showing results 60654 to 60713 of 75465

60654
W-CDMA 시스템에서 CPCH 액세스 방식의 성능 분석

소재우; 조동호researcher, 한국통신학회 추계종합학술 발표회, pp.379 - 382, 한국통신학회, 2000-11

60655
W-CDMA 터보디코딩을 위한 효율적인 Stopping Criteria

이동수; 박인철researcher, 대한전자공학회 추계학술대회, pp.265 - 268, 대한전자공학회, 2003-11

60656
W-doped TiO2 as a support for the OER catalyst in polymer electrolyte membrane water electrolysis

Kim, Eomji; Cho, Eun Aeresearcher, 2016년도 연료전지 심포지엄, 한국전기화학회, 2016-09-01

60657
W-Nb-Ti-V-Mo 고엔트로피 합금의 기계적 합금화 거동

강병철; 류호진researcher; 홍순형researcher, 추계분말야금학회, 분말야금학회, 2015-11-05

60658
W-밴드데역에서의 칩투칩통신을 위한 고이득 및 광대역 비발디 안테나

JANG, TAEHWAN; Kim, Hong-Yi; Oh, Inn-Yeal; Park, Chul Soonresearcher, 2014년 한국ITS학회 추계학술대회, 한국ITS학회, 2014-10-31

60659
W/CoFeB/MgO 구조에서 스핀-오빗 토크와 스핀 홀 자기저항의 상관관계

백승헌; 조순하; 조영훈; 박병국researcher, 2015 동계학술대회, 한국 자기학회, 2015-11-27

60660
W2F2Q : 무선 패킷 네트워크에서 공평 큐잉

이융researcher; 석용호; 최양희; 한동원, 한국통신학회 하계학술대회, 2000

60661
W2F2Q: Packet Fair Queuing inWireless Packet Networks

Yi, Yungresearcher; Seok, Yongho; Kwon, Taekyoung; Choi, Yanghee; Park, Junseok, The 3rd ACM International Workshop on Wireless Mobile Multimedia, WoWMoM 2000, pp.2 - 10, ACM, 2000-08-11

60662
WADN: Web Application Delivery Network

Kim, Jungsook; Jo, SungJae; Song, Junehwaresearcher; Lim, Minyeol; Park, Hyungwoo, International Conference on Ubiquitous Computing(ICUC), pp.0 - 0, ICUC, 2003-10-01

60663
Wafer admission control for clustered photolithography tools

Park, Kyungsu; Morrison, James Rresearcher, Advanced Semiconductor Manufacturing Conference , pp.220 - 225, ASMC, 2010-07

60664
Wafer admission control for clustered photolithography tools

Park, Kyung Sooresearcher; Morrison J.R., 2010 IEEE/SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2010, pp.220 - 225, 2010-07-11

60665
Wafer Coating Process of Cu-based Methanol Steam Reforming Catalysts for Wafer Based MEMS Catalytic Reactor

Kim, Taegyu; Lee, Dae Hoon; Yoon, Chun Ho; Kwon, Sejinresearcher, The 6th International Symposium on Nanocomposites & Nanoporous Materials, 2005-02

60666
Wafer level ACA packages and their applications to advanced electronic packaging

Paik, Kyung-Wookresearcher; Son, HY; Kim, I; Chung, CK, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.450 - 456, 2008-12-09

60667
Wafer Level Fabrication of Plasmonic Nanopores using Solid-state Diffusion

Hwang, Charles Soon Hong; Lee, Young Seop; Jeong, Ki Hunresearcher, 한국광학회 2016년도 하계학술대회, (사)한국광학회, 2016-07-11

60668
Wafer level package using pre-applied Anisotropic Conductive Films (ACFs) for flip-chip interconnections

Son, HY; Chung, CK; Yim, MJ; Paik, Kyung-Wookresearcher, IEEE 56th Electronic Components and Technology Conference, pp.565 - 569, IEEE, 2006-05-30

60669
Wafer Level Package Using Pre-Applied Anisotropic Conductive Films(ACFs)

Son, Ho-Young; Chung, Chang-Kyu; Paik, Kyung-Wookresearcher, 2007 Pan Pacific Microelectronics Symposium & Tabletop Exhibition, pp.0 - 0, 2007-01

60670
Wafer level packages (WLPs) using anisotropic conductive adhesives (ACAs) solution for flip-chip interconnections

Kim, I; Jang, KW; Son, HY; Kim, JH; Paik, Kyung-Wookresearcher, 2008 58th Electronic Components and Technology Conference, ECTC, pp.219 - 224, 2008-05-27

60671
Wafer Level Packages (WLPs) using B-stage Non-conductive Films (NCFs) for Highly Reliable 3D-TSV Micro-bump Interconnection

Lee, Hyeong-Gi; Choi, Yong-Won; Shin, Ji-won; Paik, Kyung-Wookresearcher, 65th Electronic Components and Technology Conference, IEEE Electronic Components and Technology Conference, 2015-05-27

60672
Wafer level packages (WLPs) using pre-applied anisotropic conductive films (ACFs)

Paik, Kyung-Wookresearcher; Son, HY; Chung, CK, Polytronic 2007 - 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, pp.153 - 158, 2007-01-15

60673
Wafer polishing performance of silica slurries with silica particles grown by sol-gel method

Bae, SH; So, JH; Yang, Seung-Manresearcher; Kim, DH, Material Research Society 2000 Spring Meeting, 2000

60674
Wafer temperature simulation and control algorithm in RTA system

조병진researcher; Kim, KT; Kim, CK, Conf. on CAD, Semiconductor Material and Components, pp.0 - 0, 1987-05-12

60675
Wafer to wafer bonding using electroplated Co-Sn solder layer

Kim, SH; Yu, Jinresearcher, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008, pp.313 - 316, 2008-10-22

60676
Wafer-scale Fabrication of 3D Asymmetric Hierarchical Photonic Structures in Nature

Yang, Sung Pyo; Jeong, Ki Hun, ISNIT 2016, ISNIT, 2016-01-13

60677
Wafer-scale fabrication of biodegradable silk-fibroin-based memristors

Kook, Geon; Jeong, Sohyeon; Kim, Mikyung; Lee, Sungwoo; Kim, Hyojung; Choi, Nakwon; Lee, Hyunjoo Jennyresearcher, 31st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2018, pp.86 - 89, Institute of Electrical and Electronics Engineers Inc., 2018-01-22

60678
Wake Analysis and Visualization for Offshore Floating Wind Turbine

Kim, Hyuncheol; Han, Soonhungresearcher, International Symposium on Computational Design and Engineering 2017, Society for Computational Design and Engineering, 2017-12-14

60679
Wake galloping based wind energy harvesting device for civil engineering applications

Jung, Hyung-Joresearcher; Kim, In-Ho; Lee, Seung-Woo, International Conference on Computational and Experimental Engineering and Sciences (ICCES'14), ICCES, 2014-06-16

60680
Wake Measurements of an Oscillating Airfoil

Park, Seung Oresearcher, International Symposium on Refined Flow Modelling and turbulence Measurements, 1985-09

60681
Wakefield effects on the beam instability in the microtron recuperator

Cho, Sung Ohresearcher; Lee, Byung Cheol; Jeong, Young Uk; Kim, Sun Kook; Lee, Jongmin, Proceedings of 20th International Free Electron Laser Conference, 1998

60682
Wakeup synthesis and its buffered tree construction for power gating circuit designs

Paik, S.; Kim, S.; Shin, Youngsooresearcher, 16th ACM/IEEE International Symposium on Low-Power Electronics and Design, ISLPED'10, pp.413 - 418, ACM/IEEE, 2010-08-18

60683
Walking adaptations on a split-belt treadmill are made to facilitate energetically optimal gait

Lee, Myunghyun; Thajchayapong, Montakan; Chang, Young-hui; Park, Sukyungresearcher, Dynamic Walking Conference 2014, Dynamic Walking, 2014-06-12

60684
Walking and Control of Autonomous Biped Robot

Oh, Jun-Horesearcher, IFAC Workshop on Mobile Robot Technology, pp.179 - 183, IFAC, 2001-05

60685
Walking control of the humanoid platform KHR-1 based on torque feedback control

Kim, J.H.; Oh, Jun-Horesearcher, Proceedings- 2004 IEEE International Conference on Robotics and Automation, v.2004, no.1, pp.623 - 628, 2004-04-26

60686
Walking Motion Detection via Classification of EMG Signals

Lim, Jong-Taeresearcher; Choi, HL; Byun, HJ; Song, WG; Son, JW, the International Conference on Control, Automation and Systems, pp.499 - 502, 2001-10

60687
Walking Pattern Generation on Inclined and Uneven Terrains forHumanoid Robots

Kim, Jong-Hwanresearcher; Hong, Young-Dae, The 1st International Conference on Robot Intelligence Technology and Applications (RiTA), Korea Robot Soccer Association, 2012-12

60688
Walking pattern generator using an evolutionary central pattern generator

Park, C.-S.; Yoo, J.-K.; Hong, Y.-D.; Lee, K.-B.; Ryu, S.-J.; Kim, Jong-Hwanresearcher, 13th FIRA Robot World Congress on Trends in Intelligent Robotics, FIRA 2010, pp.65 - 72, FIRA 2010, 2010-09-15

60689
Walking phase recognition for people with lower limb disability

Lee S.W.; Yi T.; Han J.-S.; Jang H.; Kim H.-H.; Jung J.-W.; Bien, Zeung namresearcher, 2007 IEEE 10th International Conference on Rehabilitation Robotics, ICORR'07, pp.60 - 67, IEEE, 2007-06-12

60690
Walking phase recognition for people with lower limb disability

Lee, Sang Wanresearcher; Yi, Taeyoub; Han, Jeong-Su; Jang, Hyoyoung; Kim, Heon-Hui; Jung, Jin-Woo; Bien, Zeungnam, 2007 IEEE 10th International Conference on Rehabilitation Robotics, ICORR'07, pp.60 - 67, IEEE, 2007-06

60691
Walking Support Robot System for the Disabled

Lee, Choon-Young; Lee, Ju-Jangresearcher, 2000 International Symposium on Mechatronics and Intelligent Mechanical System for 21 Centry, pp.59 - 64, International Symposium on Mechatronics and Intelligent Mechanical System for 21 Centry, 2000-10

60692
Walking-wheeling dual mode strategy for humanoid robot, DRC-HUBO+

Bae, Hyoin; Lee, Inho; Jung, Taejin; Oh, Jun Ho, IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS 2016) , pp.1342 - 1348, IEEE Robotics and Automation Society (RAS), 2016-10-11

60693
Wall Bounded turbulent Shear Flow Predictions with Anisotropic Two-Equation Turbulence Model

Park, Seung Oresearcher; Koo, H. M; Cho, S. H., Numerical methods in laminar and turbulent flow; Proceedings of the 7th International Conference, v.7, pp.233 - 243, 1991-07

60694
Wall Charge Behaviors in an AC Microplasma Devices with Auxiliary Electrode

Choi, Kyung Cheolresearcher; Mun, JH; Kim, SH, IEEE, pp.166 - 166, 2007-06

60695
Wall Effect on the Performance of Sonic Nozzle

Choi, Y.M.; Park, K.A.; Park, Seung Oresearcher, IMEKO World Congress, pp.76 - 81, 1997-06

60696
Wall Pressure Fluctuations and Flow Induced Noise in a Turbulent Boundary Layer over a Bump

Kim, J.N.; Sung, Hyung Jinresearcher, 6th KSME-JSME Thermal and Fluids Engineering Conference, pp.0 - 0, 2005-03-20

60697
Wall Pressure Fluctuations and Flow Induced Noise in a Turbulent Boundary Layer over a Bump

Sung, Hyung Jinresearcher, 3rd International Conference on Vortex Flows and Vortex Models, 2005-11-21

60698
Wall Pressure Fluctuations in a Turbulent Boundary Layer after Blowing or Suction

Kim, J.; Kim, K.; Sung, Hyung Jinresearcher, Third International Symposium on Turbulence and Shear Flow Phenomena, pp.0 - 0, 2003-06-25

60699
Wall Pressure Fluctuations in a Turbulent Boundary Layer Over a Bump

Kim, JN; Sung, Hyung Jinresearcher, The 3rd National Congress on Fluids Engineering, pp.0 - 0, 2004-08-26

60700
Wall Pressure Fluctuations in Separated and Reattaching Flows over a Backward-Facing Step

Lee, I.; Sung, Hyung Jinresearcher, 1st Symposium Turbulence and Shear Flow Phenomena, pp.1077 - 1082, 1999-12-15

60701
Wall Pressure Fluctuations of a Turbulent Separated and Reattaching Flow with Local Forcing

Liu, L.Z.; Kang, W.; Sung, Hyung Jinresearcher, 12th International Symposium on Applications of Laser Techniques to Fluid Mechanics, pp.0 - 0, 2004-07-12

60702
Wall Pressure Fluctuations of Separated Flows Affected by Unsteady Wake

Chun, S.; Sung, Hyung Jinresearcher, Workshop on Flow Noise, pp.0 - 0, 2003-03-28

60703
Wall Reflection of a Viscous Vortex Ring

Chang, Keun Sickresearcher, AIAA Paper 86-0561, AIAA 24th Aerospace Sciences Meeting, pp.6 - 9, 1986

60704
Wall Scaling Laws for a High-Reynolds Number Turbulent Pipe Flow at Reτ = 3008

Ahn, Junsun; Lee, Jae Hwa; Lee, Jin; Sung, Hyung Jinresearcher, 9th International Symposium on Turbulence and Shear Flow Phenomena, 9th International Symposium on Turbulence and Shear Flow Phenomena, 2015-07

60705
Wall-attached Structures of Streamwise Velocity Fluctuations in Turbulent Boundary Layer

Hwang, Jinyul; Sung, Hyung Jinresearcher, 70th Annual Meeting of the APS Division of Fluid Dynamics, the APS Division of Fluid Dynamics, 2017-11-19

60706
Wall-Attached Structures of Streamwise Velocity Fluctuations in Turbulent Pipe Flow

Hwang, Jinyul; Sung, Hyung Jinresearcher, 71th Annual Meeting of the APS Division of Fluid Dynamics, American Physical Society (APS), 2018-11-18

60707
Wall-Attached Structures of Velocity Fluctuations in a Turbulent Boundary Layer Subjected to Adverse Pressure Gradient

Yoon, Min; Hwang, Jinyul; Sung, Hyung Jinresearcher, 71th Annual Meeting of the APS Division of Fluid Dynamics, American Physical Society (APS), 2018-11-18

60708
Wall-thinning Visualization of Aluminum Specimen Using Stroboscopic Acoustic Shearography

Park, JW; Lee, Jung Ryulresearcher, The 2016 Asia-Pacific International Symposium on Aerospace Technology, The Japan Society of Aeronautical and Space Sciences, 2016-10

60709
Want to speak? Envisioning driver-to-driver communication for emotion regulation

Kim, Haechan; Kim, Do-Hyeong; Lee, Kun-Pyoresearcher, 10th International Conference on Design & Emotion, Design & Emotion, 2016-09-27

60710
Warpage Analysis of Chip Package using Tri-layer Modeling of Glass Fiber-Reinforced Polymers

김준모; 이태익; 조우성; 조민수; 김택수researcher, MPC2018 Fall Conference, 대한용접·접합학회, 2018-10-24

60711
Warpage analysis of electroplated Cu and solder resist films on polymer based packaging substrate

Kim, CG; Lee, T; Kim, MS; Kim, Taek-Sooresearcher, International Conference on Experimental Mechanics 2014, International Conference on Experimental Mechanics, 2014-11-14

60712
Warpage analysis of electroplated Cu films on polymer based packaging core substrate

김철규; 이태익; 김민성; 김택수researcher, MPC2014 Autumn Symposium, MPC, 2014-10-14

60713
Warpage behavior of chip-on-flex(COF) package under thermal cycling condition

Jang, Jae-Won; Suk, Kyoung-Lim; Paik, Kyung-Wook; Lee, Soon-Bokresearcher, Int conf. on Computer-aided Manufacturing and Design, CMD2010, 2010-11

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