Effect of substrate hot-carrier injection on quasibreakdown of ultrathin gate oxide

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dc.contributor.authorCho, Byung Jinko
dc.contributor.authorXu, Zko
dc.contributor.authorGuan, Hko
dc.contributor.authorLi, MFko
dc.date.accessioned2013-02-27T15:42:00Z-
dc.date.available2013-02-27T15:42:00Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued1999-12-
dc.identifier.citationJOURNAL OF APPLIED PHYSICS, v.86, no.11, pp.6590 - 6592-
dc.identifier.issn0021-8979-
dc.identifier.urihttp://hdl.handle.net/10203/69405-
dc.description.abstractThe quasibreakdown (QB) of ultrathin gate oxide under substrate hot-hole and -electron injection was investigated. It has been found that hot-carrier injection greatly degrades the immunity to the QB and the hot hole is more effective than the hot electron in the degradation. The phenomenon was explained by an interface damage-controlled mechanism and verified again by monitoring the interface state densities at the onset point of QB. It also has been found that QB occurs when the interface state density reaches a critical value, regardless of the stress current density and stressing carrier type. (C) 1999 American Institute of Physics. [S0021-8979(99)00523-X].-
dc.languageEnglish-
dc.publisherAMER INST PHYSICS-
dc.subjectINTERFACE TRAPS-
dc.subjectBREAKDOWN-
dc.subjectSILICON-
dc.titleEffect of substrate hot-carrier injection on quasibreakdown of ultrathin gate oxide-
dc.typeArticle-
dc.identifier.wosid000083729000103-
dc.identifier.scopusid2-s2.0-0342295713-
dc.type.rimsART-
dc.citation.volume86-
dc.citation.issue11-
dc.citation.beginningpage6590-
dc.citation.endingpage6592-
dc.citation.publicationnameJOURNAL OF APPLIED PHYSICS-
dc.identifier.doi10.1063/1.371626-
dc.contributor.localauthorCho, Byung Jin-
dc.contributor.nonIdAuthorXu, Z-
dc.contributor.nonIdAuthorGuan, H-
dc.contributor.nonIdAuthorLi, MF-
dc.type.journalArticleArticle-
dc.subject.keywordPlusINTERFACE TRAPS-
dc.subject.keywordPlusBREAKDOWN-
dc.subject.keywordPlusSILICON-
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