Reduction of cavity-to-cavity power/ground noise coupling through plane cutout in multi-layer PCBs

Publisher
IEEE
Issue Date
2004-08-09
Language
ENG
Citation

2004 IEEE International Symposium on Electromagnetic Compatibility, EMC 2004, v.1, pp.35 - 38

ISSN
1077-4076
URI
http://hdl.handle.net/10203/680
Appears in Collection
EE-Conference Papers(학술회의논문)
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