Reduction of cavity-to-cavity power/ground noise coupling through plane cutout in multi-layer PCBs
- Publisher
- IEEE
- Issue Date
- 2004-08-09
- Language
- English
- Citation
2004 IEEE International Symposium on Electromagnetic Compatibility, EMC 2004, pp.35 - 38
- ISSN
- 1077-4076
- Appears in Collection
- EE-Conference Papers(학술회의논문)
- Files in This Item
This item is cited by other documents in WoS
| ⊙ Detail Information in WoSⓡ | Click to see |  |
| ⊙ Cited 2 items in WoS | Click to see citing articles in |  |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.