ADHESION ENHANCEMENT OF POLYIMIDE ON COPPER BY AR ION-BEAM ETCHING OF COPPER

Publisher
VSP BV
Issue Date
1988
Language
ENG
Citation

JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.2, no.1, pp.245 - 253

ISSN
0169-4243
DOI
10.1163/156856188X00255
URI
http://hdl.handle.net/10203/66065
Appears in Collection
MS-Journal Papers(저널논문)
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