ELIMINATION OF SLIPS ON SILICON-WAFER EDGE IN RAPID THERMAL-PROCESS BY USING A RING OXIDE

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Publisher
AMER INST PHYSICS
Issue Date
1990-06
Language
English
Article Type
Article
Citation

JOURNAL OF APPLIED PHYSICS, v.67, no.12, pp.7583 - 7586

ISSN
0021-8979
DOI
10.1063/1.345824
URI
http://hdl.handle.net/10203/65037
Appears in Collection
EE-Journal Papers(저널논문)
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