In this paper, we report for the first time, the growth of high quality ultrathin oxynitrides formed by nitridation of SiO2 in nitric oxide (NO) ambient using in-situ rapid thermal processing (RTP). This process is highly self-limited compared with N2O oxidation of silicon. A significant improvement in the interface endurance and charge trapping properties, under constant current stress, compared to pure O-2-grown and N2O-grown oxides is observed. The NO growth process will have a great impact on future CMOS and EEPROM technologies.