SiCp/Al composites containing high volume fraction SiC particles were fabricated using a pressure infiltration casting process, and their thermophysical properties, such as thermal conductivity and coefficient of thermal expansion (CTE), were characterised. High volume fraction SiC particulate preforms containing 50 - 70 vol.-%SiC particles were fabricated by ball milling and a pressing. process, controlling the size of SiC particles and contents of an inorganic binder. 50 - 70 vol.-%SiCp/Al composites were fabricated by high pressure infiltration casting an Al melt into the SiC particulate preforms. Complete infiltration of the Al melt into SiC preform was successfully achieved through the optimisation of process parameters, such as temperature of Al melt, preheat temperature of preform, and infiltration pressure and infiltration time after pouring. Microstructures of 50 - 70 vol.-%SiCp/Al composites showed that pores resided preferentially at interfaces between the SiC particles and Al matrix with increasing volume fraction of SiC particles. The measured coefficients of thermal expansion of SiCp/Al composites Were in good agreement with the estimated values based on Turner's model. The measured thermal conductivity of SiCp/Al composites agreed well with estimated values based on the 'rule of mixture' up to 70 vol.-% of SiC particles, while they were lower than the estimated values above 70 vol.-% of SiC particles, mainly due to the residual pores at SiC/Al interfaces. The high volume fraction SiCp/Al composite is a good candidate material to substitute for conventional thermal management materials-in advanced electronic packages due to their tailorable thermophysical properties.