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Results 1-1 of 1 (Search time: 0.004 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
Reduction of fabricational thermal residual stress of the hybrid co-cured structure using a dielectrometry

Kim, HS; Lee, Dai Gilresearcher, COMPOSITES SCIENCE AND TECHNOLOGY, v.67, pp.29 - 44, 2007-01

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