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Results 1-2 of 2 (Search time: 0.002 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
Avoidance of fabricational thermal residual stresses in co-cure bonded metal-composite hybrid structures

Kim, Hak Sung; Lee, Dai Gilresearcher, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.20, no.9, pp.959 - 979, 2006

2
Reduction of fabricational thermal residual stress of the hybrid co-cured structure using a dielectrometry

Kim, HS; Lee, Dai Gilresearcher, COMPOSITES SCIENCE AND TECHNOLOGY, v.67, pp.29 - 44, 2007-01

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