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|NO||Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)|
|1||Avoidance of fabricational thermal residual stresses in co-cure bonded metal-composite hybrid structures|
Kim, Hak Sung; Lee, Dai Gilresearcher, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.20, no.9, pp.959 - 979, 2006
|2||Reduction of fabricational thermal residual stress of the hybrid co-cured structure using a dielectrometry|
Kim, HS; Lee, Dai Gilresearcher, COMPOSITES SCIENCE AND TECHNOLOGY, v.67, pp.29 - 44, 2007-01