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|NO||Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)|
|1||Reduction of fabricational thermal residual stress of the hybrid co-cured structure using a dielectrometry|
Kim, HS; Lee, Dai Gilresearcher, COMPOSITES SCIENCE AND TECHNOLOGY, v.67, pp.29 - 44, 2007-01
|2||Effects of applied pressure and temperature during curing operation on the strength of tubular single-lap adhesive joints|
Kim, JK; Lee, Dai Gilresearcher, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.18, no.1, pp.87 - 107, 2004