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|NO||Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)|
|1||Smart cure cycle with cooling and reheating for co-cure bonded steel/carbon epoxy composite hybrid structures for reducing thermal residual stress|
Kim, Hak Sung; Park, Sang Wook; Lee, Dai Gilresearcher, COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, v.37, no.10, pp.1708 - 1721, 2006
|2||Avoidance of fabricational thermal residual stresses in co-cure bonded metal-composite hybrid structures|
Kim, Hak Sung; Lee, Dai Gilresearcher, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.20, no.9, pp.959 - 979, 2006