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Results 1-10 of 135 (Search time: 0.003 seconds).

1

Nanoparticle generation using corona discharge ions from a supersonic flow in low pressure

Jung, Jae Hee; Kim, Sang Bok; Kim, Sang SooresearcherELSEVIER SCIENCE SAPOWDER TECHNOLOGY, v.185, no.1, pp.58 - 66, 2008-06

2

Finite element simulation of the plastic collapse of closed-cell aluminum foams with X-ray computed tomography

Jeon, I; Asahina, T; Kang, KJ; Lu, TJ; Im, SeyoungresearcherELSEVIER SCIENCE BVMECHANICS OF MATERIALS, v.42, pp.227 - 236, 2010-03

3

Comparison of prediction methods for low-cycle fatigue life of HIP superalloys at elevated temperatures for turbopump reliability

Lee, Soon-Bokresearcher; Bae, Keun-Ho; Lee, Keum-OhELSEVIER SCIENCE SAMATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.519, no.1-2, pp.112 - 120, 2009-08

4

Theoretical analysis of keyhole dynamics in polarized laser drilling

Cho, Jung-Ho; Na, Suck-JooresearcherIOP PUBLISHING LTDJOURNAL OF PHYSICS D-APPLIED PHYSICS, v.40, no.24, pp.7638 - 7647, 2007-12

5

Neural network applications in determining the fatigue crack opening load

Kang, JY; Song, Ji HoELSEVIER SCI LTDINTERNATIONAL JOURNAL OF FATIGUE, v.20, no.1, pp.57 - 69, 1998-01

6

A nonlinear viscoelastic constitutive model of solid propellant

Jung, GD; Youn, Sung-KieresearcherPERGAMON-ELSEVIER SCIENCE LTDINTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, v.36, no.25, pp.3755 - 3777, 1999-09

7

Extinction of an evolving jet flame under a linearly-varying flow field

Lee, EJ; Shin, Hyun DongresearcherTAYLOR & FRANCIS LTDCOMBUSTION THEORY AND MODELLING, v.8, no.1, pp.85 - 95, 2004-03

8

Cure cycle for thick glass/epoxy composite laminates

Oh, JH; Lee, Dai GilresearcherSAGE PUBLICATIONS LTDJOURNAL OF COMPOSITE MATERIALS, v.36, no.1, pp.19 - 45, 2002

9

Dielectric cure monitoring for glass/polyester prepreg composites

Kim, HG; Lee, Dai GilresearcherELSEVIER SCI LTDCOMPOSITE STRUCTURES, v.57, no.1-4, pp.91 - 99, 2002-07

10

In situ cure monitoring of adhesively bonded joints by dielectrometry

Kwon, JW; Chin, WS; Lee, Dai GilresearcherBRILL ACADEMIC PUBLISHERSJOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.17, pp.2111 - 2130, 2003

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