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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Effects of Co Addition on Bulk Properties of Sn-3.5Ag Solder and Interfacial Reactions with Ni-P UBM Kim, Dong Hoon; Cho, Moon Gi; Seo, Sun-Kyoung; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.1, pp.39 - 45, 2009-01 | |
| Influence of N-2 gas pressure on the chemical bonds of amorphous carbon nitride films Roh, Ki-Min; You, Shin-Jae; Choi, Si-Kyung; Kim, Jung-Hyung; Seong, Dae-Jin, JOURNAL OF PHYSICS D-APPLIED PHYSICS, v.42, no.17, pp.175405 - 175411, 2009-09 | |
| Secondary IMC formation induced by Kirkendall voiding in Cu/Sn-3.5Ag solder joints Kim, Sung-Hwan; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.25, no.9, pp.1854 - 1858, 2010-09 | |
| Lamellar boundary alignment of DS-processed TiAl-W alloys by a solidification procedure Jung, In-Soo; Oh, Myung-Hoon; Park, No-Jin; Kumar, K. Sharvan; Wee, Dang-Moon, METALS AND MATERIALS INTERNATIONAL, v.13, no.6, pp.455 - 462, 2007-12 | |
| Crystal orientation of beta-Sn grain in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints Seo, Sun-Kyoung; Cho, Moon Gi; Lee, HyuckMo, JOURNAL OF MATERIALS RESEARCH, v.25, no.10, pp.1950 - 1957, 2010-10 | |
| Two-layer crystallization of amorphous YMnO3 thin films on Si(100) substrates Yoo, DC; Lee, JeongYong; Kim, IS; Kim, YT, JOURNAL OF THE AMERICAN CERAMIC SOCIETY, v.86, pp.149 - 151, 2003-01 | |
| Synthesis of aligned GaN nanorods on Si (111) by molecular beam epitaxy Kim, YH; Lee, JeongYong; Lee, SH; Oh, JE; Lee, HS, APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, v.80, pp.1635 - 1639, 2005-05 | |
| Particle distribution in melt-processed Y-1.5 Ba2Cu3Ox superconductors with BaCeO3 addition Yoon, Jae-Sung; No, Kwang-Soo; Kim, Young-Ha; Mahmood, A.; Jun, B. -H.; Han, Y. -H.; Sung, T. -H.; Kim, C. -J., PHYSICA C-SUPERCONDUCTIVITY AND ITS APPLICATIONS, v.469, pp.1239 - 1243, 2009-08 | |
| Formation identification of Y2BaCuO5 and BaCeO3 in MOCVD-processed YBCO films with Ce doping Kim, Youngha; Kim, CJ; Jun, BH; Sung, TH; Han, YH; Han, SC; No, Kwangsoo, SUPERCONDUCTOR SCIENCE & TECHNOLOGY, v.22, 2009-06 | |
| Effect of Zn on the intermetallics formation and reliability of Sn-3.5Ag solder on a Cu pad Jee, YK; Ko, YH; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.22, no.7, pp.1879 - 1887, 2007-07 |
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