Browse "MS-Journal Papers(저널논문)" by Title
Showing results 6841 to 6860 of 7200
| Visualization of regulated nucleation and growth of lithium sulfides for high energy lithium sulfur batteries Xu, Zheng-Long; Kim, Sung Joo; Chang, Donghee; Park, Kyu-Young; Dae, Kyun Seong; Dao, Khoi Phuong; Yuk, Jong Min; et al, ENERGY & ENVIRONMENTAL SCIENCE, v.12, no.10, pp.3144 - 3155, 2019-10 |
| Visualization of three dimensional domain structures in ferroelectric PbTiO3 nanotubes Yoo, Hyunjun; Bae, Changdeuck; Kim, Myungjun; Hong, Daniel Seungbum; No, Kwangsoo; Kim, Yunseok; Shin, Hyunjung, APPLIED PHYSICS LETTERS, v.103, no.2, 2013-07 |
| Vitamin A microencapsulation within poly(methyl methacrylate)-g-polyethylenimine microspheres: Localized proton buffering effect on vitamin A stability Lee, JS; Nam, YoonSung; Kang, BY; Han, SH; Chang, IS, JOURNAL OF APPLIED POLYMER SCIENCE, v.92, pp.517 - 522, 2004-04 |
| VMn underlayer for CoCrPt longitudinal recording media 이택동; T.D.Lee, 한국자기학회지, v.5, no.4, pp.143 - 146, 2000-01 |
| Voltage control of a magnetization easy axis in piezoelectric/ferromagnetic hybrid films Kim, SK; Lee, JW; Shin, Sung-Chul; Song, HW; Lee, CH; No, Kwangsoo, JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, v.267, pp.127 - 132, 2003-11 |
| Voltage control of magnetization easy-axes: A potential candidate for spin switching in future ultrahigh-density nonvolatile magnetic random access memory Kim, SK; Shin, Sung-Chul; No, Kwangsoo, IEEE TRANSACTIONS ON MAGNETICS, v.40, pp.2637 - 2639, 2004-07 |
| Voltage-driven gigahertz frequency tuning of spin Hall nano-oscillators Choi, Jong-Guk; Park, Jaehyeon; Kang, Min-Gu; Kim, Doyoon; Rieh, Jae-Sung; Lee, Kyung-Jin; Kim, Kab-Jin; et al, NATURE COMMUNICATIONS, v.13, no.1, 2022-06 |
| Vortex dynamics in submicron exchange-biased disks Moon, Jung Hwan; Kim, Woo An; Lee, Taek Dong; Lee, Kyung-Jin, PHYSICA STATUS SOLIDI B-BASIC SOLID STATE PHYSICS, v.244, no.12, pp.4491 - 4494, 2007-12 |
| W 에 의한 Mo 치환이 850℃ 에서 시효된 이상 스테인레스강의 취화 특성에 미치는 영향 김상범; 백경욱; 김영길, 대한금속·재료학회지, v.35, no.12, pp.1593 - 1601, 1997-12 |
| (W,Ti)C계 초경합금의 미세조직 및 경도에 미치는금속 결합재 조성의 영향 Walid M. Daoush; 이경호; 박희섭; 장종준; 홍순형, 한국분말야금학회지, v.14, no.3, pp.208 - 214, 2007-06 |
| W-Ni-Fe중합금에서 칼슘이나 란타늄 첨가에 따른 황과 인에 의한 취화의 제거 홍성현; 강석중; 윤덕용, 대한금속·재료학회지, v.29, no.9, pp.925 - 932, 1991-01 |
| Wafer-Level Double-Layer Nonconductive Films for Flip-Chip Assembly Lee, Seyong; Lee, HanMin; Shin, Ji Won; Kim, Woojeong; Choi, Taejin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1258 - 1264, 2017-08 |
| Wafer-level flip chip packages using preapplied anisotropic conductive films (ACFs) Son, HY; Chung, CK; Yim, MJ; Hwang, JS; Paik, Kyung-Wook; Jung, GJ; Lee, JK, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.30, no.3, pp.221 - 227, 2007-07 |
| Wafer-Level Packages Using Anisotropic Conductive Adhesives (ACAs) Solution for Flip-Chip Interconnections Kim, Il; Jang, Kyung-Woon; Son, Ho-Young; Kim, Jae-Han; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.5, pp.792 - 797, 2011-05 |
| Wafer-Level Packages Using B-Stage Nonconductive Films for Cu Pillar/Sn-Ag Microbump Interconnection Lee, Hyeong Gi; Choi, Yong-Won; Shin, Ji Won; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.11, pp.1567 - 1572, 2015-11 |
| Wafer-Scale Fabrication and Characterization of Thin-Film Transistors with Polythiophene-Sorted Semiconducting Carbon Nanotube Networks Liyanage, Luckshitha Suriyasena; Lee, Hangwoo; Patil, Nishant; Park, Steve; Mitra, Subhasish; Bao, Zhenan; Wong, Hon Sum Philip, ACS NANO, v.6, no.1, pp.451 - 458, 2012-01 |
| Wafer-scale synthesis of monolayer two-dimensional porphyrin polymers for hybrid superlattices Zhong, Yu; Cheng, Baorui; Park, Chibeom; Ray, Ariana; Brown, Sarah; Mujid, Fauzia; Lee, Jae-Ung; et al, SCIENCE, v.366, no.6471, pp.1379 - 1384, 2019-12 |
| Wafer-Scale Unidirectional Alignment of Supramolecular Columns on Faceted Surfaces Jin, Hyeong Min; Park, Kangho; Kwon, Kiok; Yang, Geon Gug; Han, Young-Soo; Kim, Hwa Soo; Kim, Sang Ouk; et al, ACS NANO, v.15, no.7, pp.11762 - 11769, 2021-07 |
| Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition Jang, Jae-Won; Suk, Kyoung-Lim; Park, Jin-Hyoung; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.7, pp.1144 - 1151, 2014-07 |
| Water absorption characteristics of fluorinated silicon oxide films deposited by electron cyclotron resonance plasma enhanced chemical vapor deposition using SiH4, SiF4 and O-2 Byun, KM; Lee, Won-Jong, THIN SOLID FILMS, v.376, no.1-2, pp.26 - 31, 2000-11 |
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