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Demonstration and characterization of Sn-3.0Ag-0.5Cu/Sn-57Bi-1Ag combination solder for 3-D multistack packaging Jo, Yun-Hwan; Lee, Joo-Won; Seo, Sun-Kyoung; Lee, Hyuck-Mo; Han, Hun; Lee, Dong-Chun, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.1, pp.110 - 117, 2008-01 |
Dielectric and Raman scattering studies of phase transitions in the (100-x)Na0.5Bi0.5TiO3-xSrTiO(3) system Rout, Dibyaranjan; Moon, Kyoung-Seok; Kang, Suk-Joong L; Kim, I. W., JOURNAL OF APPLIED PHYSICS, v.108, no.8, 2010-10 |
Effects of PbO on the repassivation kinetics of alloy 690 Ahn, S; Rao, VS; Kwon, Hyuk-Sang; Kim, U, CORROSION SCIENCE, v.48, no.5, pp.1137 - 1153, 2006-05 |
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