Browse "MS-Journal Papers(저널논문)" by Subject FRACTURE ENERGY
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| Analyses of the practical adhesion strengths of the metal/polymer interfaces in electronic packaging Yu, Jin; Song, JY; Park, IS, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.12, pp.1347 - 1352, 2002-12 |
| Analysis of the T-peel strength in a Cu/Cr/polyimide system Song, JY; Yu, Jin, ACTA MATERIALIA, v.50, no.16, pp.3985 - 3994, 2002-09 |
| Phase angle in the Cu/polyimide/alumina system Park, YB; Yu, Jin, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.266, no.1-2, pp.109 - 114, 1999-06 |
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