Interfacial Reaction Product Its Effect on the Strength of Cupper to Alumina Eutetic Bonding
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | S.T. Kim | ko |
| dc.contributor.author | Kim, Chong Hee | ko |
| dc.date.accessioned | 2013-02-25T03:38:29Z | - |
| dc.date.available | 2013-02-25T03:38:29Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1992 | - |
| dc.identifier.citation | JOURNAL OF MATERIALS SCIENCE, v.27, no.8, pp.2061 - 2066 | - |
| dc.identifier.issn | 0022-2461 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/59554 | - |
| dc.description.abstract | Cu-Cu2O eutectic bonding of copper to alumina has been studied at 1075-degrees-C in nitrogen gas, In order to elucidate the reaction at the Cu/Al2O3 interface, the bonding time was prolonged up to 24 h at 1075-degrees-C in nitrogen gas. CuAlO2 was found at the Cu/Al2O3 interface, and it seems that CuAlO2 was formed even with a short bonding time. CuAlO2 enhanced the bonding strength. There seem to be two kinds of bonding mechanism working at the Cu/Al2O3 interface. | - |
| dc.language | English | - |
| dc.publisher | Springer | - |
| dc.subject | OXYGEN | - |
| dc.title | Interfacial Reaction Product Its Effect on the Strength of Cupper to Alumina Eutetic Bonding | - |
| dc.type | Article | - |
| dc.identifier.wosid | A1992HQ66700010 | - |
| dc.identifier.scopusid | 2-s2.0-0000077946 | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 27 | - |
| dc.citation.issue | 8 | - |
| dc.citation.beginningpage | 2061 | - |
| dc.citation.endingpage | 2066 | - |
| dc.citation.publicationname | JOURNAL OF MATERIALS SCIENCE | - |
| dc.contributor.nonIdAuthor | S.T. Kim | - |
| dc.type.journalArticle | Article | - |
| dc.subject.keywordPlus | OXYGEN | - |
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