Interfacial Reaction Product Its Effect on the Strength of Cupper to Alumina Eutetic Bonding

Cu-Cu2O eutectic bonding of copper to alumina has been studied at 1075-degrees-C in nitrogen gas, In order to elucidate the reaction at the Cu/Al2O3 interface, the bonding time was prolonged up to 24 h at 1075-degrees-C in nitrogen gas. CuAlO2 was found at the Cu/Al2O3 interface, and it seems that CuAlO2 was formed even with a short bonding time. CuAlO2 enhanced the bonding strength. There seem to be two kinds of bonding mechanism working at the Cu/Al2O3 interface.
Publisher
Springer
Issue Date
1992
Language
ENG
Keywords

OXYGEN

Citation

JOURNAL OF MATERIALS SCIENCE, v.27, no.8, pp.2061 - 2066

ISSN
0022-2461
URI
http://hdl.handle.net/10203/59554
Appears in Collection
MS-Journal Papers(저널논문)
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