반도체패키지에서의 층간박리 및 패키지균열에 대한 파괴학적 연구(2) -패키지균열- A Fracture Mechamics Approach on Delamination and Package Crack in Electronic Packaging: III. Package Crack

Publisher
대한기계학회
Issue Date
1994-01
Language
KOR
Citation

대한기계학회논문집, v.18, pp.2158 - 2166

ISSN
1226-4873
URI
http://hdl.handle.net/10203/57338
Appears in Collection
NE-Journal Papers(저널논문)
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