The Suppression of Chemically Induced Liquid Film Migration in Co-Cu at High Temperature

Publisher
Pergamon Press Ltd.
Issue Date
1993
Language
ENG
Citation

ACTA METALLURGICA ET MATERIALIA, v.42, pp.913 - 919

ISSN
0956-7151
URI
http://hdl.handle.net/10203/57337
Appears in Collection
MS-Journal Papers(저널논문)
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