DC Field | Value | Language |
---|---|---|
dc.contributor.author | Jeong, Y. | ko |
dc.contributor.author | Lu, A.C.W. | ko |
dc.contributor.author | Wai, L.L. | ko |
dc.contributor.author | Fan, W. | ko |
dc.contributor.author | Lok, B.K. | ko |
dc.contributor.author | Kim, Joungho | ko |
dc.date.accessioned | 2007-06-20T06:55:18Z | - |
dc.date.available | 2007-06-20T06:55:18Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2004-06-01 | - |
dc.identifier.citation | 2004 Proceedings - 54th Electronic Components and Technology Conference, pp.575 - 580 | - |
dc.identifier.issn | 0569-5503 | - |
dc.identifier.uri | http://hdl.handle.net/10203/569 | - |
dc.description.sponsorship | Authors would like to acknowledge the collaborative research project funding and support from Singapore Institute of Manufacturing Technology, A*STAR, and Korea Advanced Institute of Science and Technology, Terahertz Media and System Laboratory (Dept of EE and CS). | en |
dc.language | English | - |
dc.language.iso | en_US | en |
dc.publisher | IEEE | - |
dc.title | Analysis of coupling suppression methods on split power/ground planes using embedded capacitor in multi-layered package | - |
dc.type | Conference | - |
dc.identifier.wosid | 000224340900089 | - |
dc.identifier.scopusid | 2-s2.0-10444252517 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 575 | - |
dc.citation.endingpage | 580 | - |
dc.citation.publicationname | 2004 Proceedings - 54th Electronic Components and Technology Conference | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | Las Vegas, NV | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Kim, Joungho | - |
dc.contributor.nonIdAuthor | Jeong, Y. | - |
dc.contributor.nonIdAuthor | Lu, A.C.W. | - |
dc.contributor.nonIdAuthor | Wai, L.L. | - |
dc.contributor.nonIdAuthor | Fan, W. | - |
dc.contributor.nonIdAuthor | Lok, B.K. | - |
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