Twisted differential line structure on high-speed printed circuit boards to reduce crosstalk and radiated emission

Differential signaling has become a popular choice for high-speed digital interconnection schemes on printed circuit boards (PCBs), offering superior immunity to crosstalk and external noise. However, conventional differential lines on PCBs still have unsolved problems, such as crosstalk and radiated emission. When more than two differential pairs run in parallel, a line is coupled to the line adjacent to it because all the lines are parallel in a fixed order. Accordingly, the two lines that constitute a differential pair are subject to the differential-mode crosstalk that cannot be canceled out by virtue of the differential signaling. To overcome this, we propose a twisted differential line (TDL) structure on a high-speed multilayer PCB by using a concept similar to a twisted pair in a cable interconnection. It has been successfully demonstrated by measurement and simulation that the TDL is subject to much lower crosstalk and achieves a 13-dB suppression of radiated emission, even when supporting a 3-Gb/s data rate.
Publisher
Institute of Electrical and Electronics Engineers
Issue Date
2004-11
Language
ENG
Keywords

PACKAGE

Citation

IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.27, no.4, pp.590 - 596

ISSN
1521-3323
DOI
10.1109/TADVP.2004.831838
URI
http://hdl.handle.net/10203/559
Appears in Collection
EE-Journal Papers(저널논문)
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