Analysis, simulation and applications of passive devices by using low temperature co-fired ceramic method

Abstract

The rapid developments of wireless communication technology give an interest to package one chip. At first, their interests only integrate active devices on the focusing, but nowadays many engineers try to integrate whole circuit system. To meet integrate active and passive devices, Low Temperature Cofired Ceramic (LTCC) is considered candidate of one step packaging. These passive devices made by LTCC process have high electrical performance due to each layer patterning. Also we can make devices by stacking vertically in a small area at once and easily. In this thesis, I would like to know the characteristics of passive devices by using LTCC method to realize WCDMA and WLAN module as a first step. To perform this realization, I made equivalent circuit first and I compared parasitic components to previously proposed data. In this comparison, I know my equivalent modeling is reasonable. From these results, I realized inductors and capacitors in Momentum simulator and CAD. The difficulties of passive device realization are high Q devices and high Self-resonant Frequency (SRF). This means that devices, which have low Q values and SRF, are not properly operated at high frequency such as 5GHz. To make good devices that``s the best way to use low dielectric constant material, but I made sample by using dielectric constant is 38. This material may not satisfy our expectations, but to develop into many ways I boldly choose this sheet from other university. Also, we developed proper silver paste by mixing palladium. In this work, through the LTCC process, I get the passive device``s modeling technology. Further more, I expect this research to be a basic in performing System on Chip (SoC).