Co-modeling and co-simulation of package and on-chip decoupling capacitor for resonant free power/ground network design

Publisher
IEEE
Issue Date
2005-05-31
Language
ENG
Citation

55th Electronic Components and Technology Conference, ECTC, v.1, pp.727 - 731

ISSN
0569-5503
URI
http://hdl.handle.net/10203/543
Appears in Collection
EE-Conference Papers(학술회의논문)
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