Cu-epoxy 계의 접착력에 관한 연구 = A study on the adhesion of Cu-epoxy system

Advisors
이원종researcherLee, Won-Jongresearcher
Publisher
한국과학기술원
Issue Date
1995
Identifier
99504/325007 / 000933502
Language
kor
Description

학위논문(석사) - 한국과학기술원 : 전자재료공학과, 1995.2, [ [v], 67 p. ]

URI
http://hdl.handle.net/10203/51280
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=99504&flag=t
Appears in Collection
MS-Theses_Master(석사논문)
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