인듐 범프를 이용한 VCSEL 어레이의 플립칩 본딩 최적화Optimization of flip chip bonding for a VCSEL array using indium bumps
- Advisors
- 전덕영researcher; Jeon, Duk-Youngresearcher
- Description
- 한국과학기술원 : 재료공학과,
- Publisher
- 한국과학기술원
- Issue Date
- 2003
- Identifier
- 180283/325007 / 020013587
- Language
- kor
- Description
학위논문(석사) - 한국과학기술원 : 재료공학과, 2003.2, [ iv, 94 p. ]
- Keywords
솔더댐; 광연결; 플립칩; 인듐솔더범프; 수직공진형 표면방출레이저; 은; silver; UBM; optical interconnection; flip chip; indium solder bump; VCSEL
- Appears in Collection
- MS-Theses_Master(석사논문)
- Files in This Item
- There are no files associated with this item.
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