인듐 범프를 이용한 VCSEL 어레이의 플립칩 본딩 최적화 = Optimization of flip chip bonding for a VCSEL array using indium bumps

Advisors
전덕영researcherJeon, Duk-Youngresearcher
Publisher
한국과학기술원
Issue Date
2003
Identifier
180283/325007 / 020013587
Language
kor
Description

학위논문(석사) - 한국과학기술원 : 재료공학과, 2003.2, [ iv, 94 p. ]

Keywords

솔더댐; 광연결; 플립칩; 인듐솔더범프; 수직공진형 표면방출레이저; 은; silver; UBM; optical interconnection; flip chip; indium solder bump; VCSEL

URI
http://hdl.handle.net/10203/50919
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=180283&flag=t
Appears in Collection
MS-Theses_Master(석사논문)
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