열산화된 리드프레임과 EMC와의 접착력에 관한 연구A study on the adhesion between thermally oxidized leadframe and epoxy molding compounds
- Advisors
- 유진researcher; Yu, Jinresearcher
- Description
- 한국과학기술원 : 재료공학과,
- Publisher
- 한국과학기술원
- Issue Date
- 1997
- Identifier
- 128152/325007 / 000957510
- Language
- kor
- Description
학위논문(석사) - 한국과학기술원 : 재료공학과, 1997.8, [ iii, 55 p. ]
- Keywords
접착력; 봉지재; 리드 프레임; 산화; 실장; Packaging; Adhesion; EMC; Lead frame; Oxidation
- Appears in Collection
- MS-Theses_Master(석사논문)
- Files in This Item
- There are no files associated with this item.
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