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학위논문(석사) - 한국과학기술원 : 재료공학과, 1996.2, [ [iii], 61 p. ]
Sn-In-Bi; 무연솔더; 전자패키징; 열역학; Thermodynamics; Sn-In-Bi; Pb-free solder; Interconnection
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