금속 유기 화학 증착법에 의해 증착된 구리 박막의 증착 및 물성에 관한 연구 = A study on the deposition and the film characteristics of MOCVD copper thin films

Advisors
천성순researcherChun, Soung-Soonresearcher
Publisher
한국과학기술원
Issue Date
1996
Identifier
106199/325007 / 000925231
Language
kor
Description

학위논문(박사) - 한국과학기술원 : 재료공학과, 1996.2, [ v, 89 p. ]

Keywords

유기 금속 화학 증착법; 구리박막; Copper thin film; MOCVD

URI
http://hdl.handle.net/10203/50144
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=106199&flag=t
Appears in Collection
MS-Theses_Ph.D.(박사논문)
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