전자패키징용 복합 솔더에서 Cu/Ni 비율에 따른 금속간 화합물의 형성과 특성 평가에 관한 연구A Study of the effect of the Cu/Ni ratio on formation of intermetallic compounds and evaluation of reliability in the Cu-Ni-bearing composite solders
- Advisors
- 이혁모researcher; Lee, Hyuck-Moresearcher
- Description
- 한국과학기술원 : 신소재공학과,
- Publisher
- 한국과학기술원
- Issue Date
- 2006
- Identifier
- 258119/325007 / 020015860
- Language
- kor
- Description
학위논문(박사) - 한국과학기술원 : 신소재공학과, 2006.8, [ 134 p. ]
- Keywords
lead free composite solder; 무연 복합 솔더
- Appears in Collection
- MS-Theses_Ph.D.(박사논문)
- Files in This Item
- There are no files associated with this item.
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