전자패키지용 Sn-Ag-Cu계 무연 솔더 접합부의 금속간 화합물 성장과 전단강도에 미치는 냉각속도의 영향Effect of cooling rate on growth of IMC and shear strength of near eutectic Sn-Ag-Cu solder joint
- Advisors
- 이혁모researcher; Lee, Hyuck-Moresearcher
- Description
- 한국과학기술원 : 신소재공학과,
- Publisher
- 한국과학기술원
- Issue Date
- 2004
- Identifier
- 240665/325007 / 000995337
- Language
- kor
- Description
학위논문(박사) - 한국과학기술원 : 신소재공학과, 2004.8, [ xii, 117 p. ]
- Keywords
SNAGCU ATION; LEAD-FREE SOLDER; 금속간화합물; 전단강도; 전자패키지계면반응; SHEAR STRENGTHON; 무연솔더; SN-AG-CU; INTERMETALLIC COMPOUND
- Appears in Collection
- MS-Theses_Ph.D.(박사논문)
- Files in This Item
- There are no files associated with this item.
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