Thermodynamics-aided alloy design and evaluation of Pb-free solders fdr high-temperature applications

High temperature solders that will not be affected in the subsequent thermal treatment are required in the step soldering process of multi-chip module (MCM) packaging. High-Pb solder alloys such as 95Pb-5Sn (numbers are all in mass% unless specified otherwise) are currently being used for this purpose. However, the development of the Pb-free solder alloy for high temperature applications is needed due to environmental issues. The solder alloys of Bi-Ag, Sn-Sb and Au-Sb-Sn systems are considered as candidates in this study. Aided by thermodynamic calculations, several specific compositions have been chosen and they were investigated in terms of melting behavior, electrical resistivity, wetting angle and hardness. The Bi-Ag alloy exhibited poor electro-conductivity while the Sn-Sb system had low melting temperatures. The ternary Au-Sn-Sb solder alloy shows prospects for high temperature applications in spite of poor wetting properties.
Publisher
JAPAN INST METALS
Issue Date
2002-08
Language
ENG
Keywords

SN

Citation

MATERIALS TRANSACTIONS, v.43, no.8, pp.1873 - 1878

ISSN
1345-9678
URI
http://hdl.handle.net/10203/4606
Appears in Collection
MS-Journal Papers(저널논문)
  • Hit : 433
  • Download : 2
  • Cited 0 times in thomson ci
This item is cited by other documents in WoS
⊙ Detail Information in WoSⓡClick to seewebofscience_button
⊙ Cited 37 items in WoSClick to see citing articles inrecords_button

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0